Support structures for electromechanical systems and methods of fabricating the same

• US 8,081,370 B2
• Filed: 05/05/2009
• Issued: 12/20/2011
• Est. Priority Date: 09/27/2004
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Sampsell, Jeffrey B.
• Primary Examiner(s): Choi, William
• Application Number:
  US12/436,000
• Publication Number:
  US 20090213450A1
• Time in Patent Office: 959 Days
• Field of Search: 359/198.1, 359/221.2, 359/224.1, 359/290
• US Class Current: 359/290
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81B 2203/0361 Tips, pillars
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

A method of making an interferometric modulator element includes forming at least two posts, such as posts formed from spin-on glass, on a substrate. In alternate embodiments, the posts may be formed after certain layers of the modulator elements have been deposited on the substrate. An interferometric modulator element includes at least two spin-on glass support posts located on the substrate. In alternate embodiments, the support posts may be located over certain layers of the modulator element, rather than on the substrate. A method of making an interferometric modulator element includes forming a rigid cap over a support post. An interferometric modulator element includes support posts having rigid cap members.

Claims

1. An electromechanical device, comprising:

an optical stack located over a substrate;

a flexible layer spaced apart from the optical stack by a gap; and

a support structure located between the optical stack and the flexible layer, wherein the support structure comprises

a first layer comprising a material more rigid than the flexible layer, wherein the first layer of the support structure comprises a non-planarizing material, and

a second layer overlying the first layer.

2. The device of claim 1, wherein a width of the support structure increases with increased distance from the optical stack.

3. The device of claim 1, wherein the support structure comprises an outwardly extending portion located away from the optical stack.

4. The device of claim 1, wherein the support structure comprises an oxide.

5. The device of claim 1, wherein the support structure comprises an insulating material.

6. An electromechanical device, comprising:

an optical stack located over a substrate;

support structures located over the substrate;

a flexible layer spaced apart from the optical stack by a cavity, wherein the flexible layer is supported by the support structures; and

at least one overlying support structure over a portion of the flexible layer, wherein the overlying support structure comprises a non-planarizing material, and wherein at least a portion of the at least one overlying support structure is located over a support structure.

7. The device of claim 6, wherein the support structures comprise portions of the flexible layer which contact the optical stack.

8. The device of claim 6, wherein the overlying support structure is more rigid than the flexible layer.

9. The device of claim 6, wherein the overlying support structure comprises the same material as the flexible layer.

10. The device of claim 6, wherein the overlying support structure comprises nickel.

11. The device of claim 6, wherein the support structure comprises an oxide.

12. The device of claim 6, wherein the support structure comprises an insulating material.

13. An electromechanical device, comprising:

an optical stack located over a substrate;

an insulating layer located over the optical stack;

support structures located over the substrate, wherein a width of the support structures increases with increased distance from the optical stack; and

a deformable layer spaced apart from the optical stack and adjacent the support structures, wherein the support structures comprise;

a rigid sublayer; and

an insulating sublayer located between the rigid sublayer and the deformable layer.

14. The device of claim 13, wherein the support structures overlie the deformable layer.

15. The device of claim 13, wherein the support structures underlie the deformable layer.

16. The device of claim 13, wherein the deformable layer comprises a mechanical sublayer and a reflective sublayer on the side of the deformable layer facing the optical stack.

17. The device of claim 16, wherein the support structures comprise a material used in the deformable layer.

18. An electromechanical device, comprising:

an optical stack located over a substrate;

a flexible layer spaced apart from the optical stack by a gap; and

a support structure located between the optical stack and the flexible layer, wherein a width of the support structure increases with increased distance from the optical stack, and wherein the support structure comprises

a first layer comprising a material more rigid than the flexible layer, and

a second layer overlying the first layer.

19. The device of claim 18, wherein the first layer of the support structure comprises a non-planarizing material.

20. The device of claim 18, wherein the support structure comprises an outwardly extending portion located away from the optical stack.

21. An electromechanical device, comprising:

an optical stack located over a substrate;

support structures located over the substrate;

a flexible layer spaced apart from the optical stack by a cavity, wherein the flexible layer is supported by the support structures; and

at least one overlying support structure over a portion of the flexible layer, wherein the overlying support structure comprises the same material as the flexible layer, and wherein at least a portion of the at least one overlying support structure is located over a support structure.

22. The device of claim 21, wherein the support structures comprise portions of the flexible layer which contact the optical stack.

23. The device of claim 21, wherein the overlying support structure comprises nickel.

24. The device of claim 21, wherein the support structure comprises an oxide.

25. An electromechanical device, comprising:

an optical stack located over a substrate;

an insulating layer located over the optical stack;

support structures located over the substrate; and

a deformable layer spaced apart from the optical stack, wherein the support structures overlie the deformable layer, and wherein the support structures comprise;

a rigid sublayer; and

an insulating sublayer located between the rigid sublayer and the deformable layer.

26. The device of claim 25, wherein the deformable layer comprises a mechanical sublayer and a reflective sublayer on the side of the deformable layer facing the optical stack.

27. The device of claim 26, wherein the support structures comprise a material used in the deformable layer.

28. The device of claim 25, wherein a width of the support structure increases with increased distance from the optical stack.

29. An electromechanical device, comprising:

an optical stack located over a substrate;

an insulating layer located over the optical stack;

support structures located over the substrate; and

a deformable layer spaced apart from the optical stack and adjacent the support structures, wherein the deformable layer comprises a mechanical sublayer and a reflective sublayer on the side of the deformable layer facing the optical stack, and wherein the support structures comprise;

a rigid sublayer; and

an insulating sublayer located between the rigid sublayer and the deformable layer.

30. The device of claim 29, wherein the support structures overlie the deformable layer.

31. The device of claim 29, wherein the support structures underlie the deformable layer.

32. The device of claim 29, wherein the support structures comprise a material used in the deformable layer.

33. The device of claim 29, further comprising:

a processor that is in electrical communication with at least one of the optical stack or the deformable layer, said processor being configured to process image data; and

a memory device in electrical communication with said processor.

34. The device of claim 33, further comprising:

a first controller configured to send at least one signal to at least one of the optical stack or the deformable layer; and

a second controller configured to send at least a portion of said image data to said first controller.

35. The device of claim 33, further comprising:

an image source module configured to, send said image data to said processor.

36. The device of claim 35, wherein said image source module comprises at least one of a receiver, transceiver, and transmitter.

37. The device of claim 33, further comprising:

an input device configured to receive input data and to communicate said input data to said processor.