Methods of fabricating a semiconductor device

• US 8,084,344 B2
• Filed: 11/13/2008
• Issued: 12/27/2011
• Est. Priority Date: 12/13/2007
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Jong-Won, Han, Sang-Yeob, Hong, Chang-Ki, Yoon, Bo-Un, Lee, Jae-Dong
• Primary Examiner(s): Richards, N Drew
• Assistant Examiner(s): Withers, Grant
• Application Number:
  US12/292,195
• Publication Number:
  US 20090155991A1
• Time in Patent Office: 1,139 Days
• Field of Search: 438/586
• US Class Current: 438/586
• CPC Class Codes: H01L 21/76897 Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665
• CPC Class Codes: H01L 29/6653 using the removal of at least part of spacer, e.g. disposable spacer
• CPC Class Codes: H10B 12/0335 Making a connection between the transistor and the capacitor, e.g. plug
• CPC Class Codes: H10B 12/05 Making the transistor
• CPC Class Codes: H10B 12/485 Bit line contacts

Abstract

A method of fabricating a contact plug of a semiconductor device is provided, the method includes forming a gate pattern on a substrate, forming a capping pattern to cover an upper surface and sidewalls of the gate pattern, forming an interlayer insulation layer on the substrate such that the interlayer insulation layer exposes an upper surface of the capping pattern, and removing a portion of the capping pattern and the interlayer insulation layer such that the upper surface of the capping pattern is planarized.

Claims

1. A method of fabricating a semiconductor device, the method comprising:

forming a gate pattern on a substrate;

forming a capping pattern that covers an upper surface and sidewalls of the gate pattern, the capping pattern having a convex upper surface with respect to an upper surface of the substrate;

forming an interlayer insulation layer on the substrate such that an upper surface of the capping pattern is exposed;

removing a portion of the capping pattern and the interlayer insulation layer such that the upper surface of the capping pattern is planarized; and

forming an opening to expose the substrate adjacent to the capping pattern, after the removing the portion of the capping pattern and the interlayer insulation layer.

2. The method of claim 1, wherein the forming a gate pattern comprises:

sequentially forming a gate insulation layer and a gate conductive layer on the substrate; and

forming a gate insulation layer pattern and a gate electrode by sequentially patterning the gate conductive layer and the gate insulation layer.

3. The method of claim 1, wherein the forming a capping pattern comprises:

forming a mask pattern that covers the upper surface of the gate pattern; and

forming a spacer that covers the sidewalls of the gate pattern.

4. The method of claim 3, wherein the forming a mask pattern comprises:

sequentially forming a gate insulation layer, a gate conductive layer, and a mask layer on the substrate; and

forming a gate insulation layer pattern, a gate electrode and the mask pattern by sequentially patterning the mask layer, the gate conductive layer and the gate insulation layer.

5. The method of claim 3, wherein the forming a spacer comprises:

forming a spacer layer on the substrate having the mask pattern; and

etching the spacer layer using an anisotropic etch process.

6. The method of claim 3, wherein the mask pattern and the spacer are formed of a same material.

7. The method of claim 6, wherein the same material includes silicon nitride.

8. The method of claim 1, wherein the interlayer insulation layer is formed of a silicon oxide.

9. The method of claim 1, wherein the removing a portion of the capping pattern and the interlayer insulation layer includes performing a chemical mechanical polishing (CMP) method, the CMP method uses a slurry having a polishing speed greater than, or equal to, approximately 200 Å

/min with respect to the capping pattern.

10. The method of claim 1, wherein the removing a portion of the capping pattern and the interlayer insulation layer includes performing a chemical mechanical polishing (CMP) method, the CMP method uses a slurry having a polishing speed greater than, or equal to, approximately 500 Å

/min with respect to the capping pattern.

11. The method of claim 1, wherein the removing a portion of the capping pattern and the interlayer insulation layer includes performing a chemical mechanical polishing (CMP) method, the CMP method uses a slurry having a polishing speed less than, or equal to, approximately 100 Å

/min with respect to the interlayer insulation layer.

12. The method of claim 1, wherein the removing a portion of the capping pattern and the interlayer insulation layer includes performing a chemical mechanical polishing (CMP) method, the CMP method uses a slurry having a polishing speed less than, or equal to, approximately 50 Å

/min with respect to the interlayer insulation layer.

13. The method of claim 1, wherein the removing a portion of the capping pattern and the interlayer insulation layer includes performing a chemical mechanical polishing (CMP) method, the CMP method uses a slurry having a polishing speed ratio of the capping pattern to the interlayer insulation layer of more than 2:

1.

14. The method of claim 13, wherein the polishing speed ratio of the capping pattern to the interlayer insulation layer is more than 10:

1.

15. The method of claim 1, further comprising:

forming a conductive layer that fills the opening; and

forming a contact plug by planarizing the conductive layer.

16. The method of claim 1, wherein the conductive layer is formed of polysilicon.

17. The method of claim 1, wherein a plurality of gate patterns are formed on the substrate.

18. The method of claim 17, further comprising:

forming a conductive layer that fills the opening and covers the exposed capping pattern; and

forming a contact plug by planarizing the conductive layer.

19. A method of fabricating a semiconductor device, the method comprising:

forming a transistor structure having a planar upper surface on a substrate;

forming a capping pattern that covers an upper surface and sidewalls of the gate pattern, the capping pattern having a convex upper surface with respect to an upper surface of the substrate;

removing a portion of the capping pattern and an interlayer insulating layer adjacent to the transistor structure;

forming a cavity that exposes a portion of the substrate after the removing step; and

forming a conductive plug in the cavity.

20. A method of fabricating a semiconductor device, the method comprising:

forming a gate pattern on a substrate;

forming a capping pattern that covers an upper surface and sidewalls of the gate pattern, the capping pattern having a convex upper surface with respect to an upper surface of the substrate;

forming an interlayer insulation layer on the substrate such that an upper surface of the capping pattern is exposed; and

removing a portion of the capping pattern and the interlayer insulation layer such that the upper surface of the capping pattern is planarized.