Hotmelt adhesive with good adhesion to polyolefins

• US 8,084,527 B2
• Filed: 11/12/2008
• Issued: 12/27/2011
• Est. Priority Date: 12/04/2007
• Status: Expired due to Fees

• Current Assignee: Sika Technology Ag (Compagnie de Saint-Gobain SA)
• Original Assignee: Sika Technology Ag (Compagnie de Saint-Gobain SA)
• Inventors: Paschkowski, Kai, Plaumann, Joerg
• Primary Examiner(s): Seidleck, James J
• Assistant Examiner(s): Valdez, Deve E
• Application Number:
  US12/292,137
• Publication Number:
  US 20090142610A1
• Time in Patent Office: 1,140 Days
• Field of Search: 524/236, 524/217, 528/80, 525/55, 525/127, 525/123, 525/374, 525/540, 525/69, 428/354, 428/515, 428/355.R, 428/520
• US Class Current: 524/217
• CPC Class Codes: B32B 27/12 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 27/32 comprising polyolefins comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C08J 2351/06 grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
• CPC Class Codes: C08J 5/128 Adhesives without diluent
• CPC Class Codes: C08K 5/20 Carboxylic acid amides
• CPC Class Codes: C08L 2205/02 containing two or more polymers of the same C08L -group
• CPC Class Codes: C08L 2205/035 containing four or more polymers in a blend
• CPC Class Codes: C08L 2207/14 Amorphous or atactic polypropylene
• CPC Class Codes: C08L 23/14 Copolymers of propene C08L23/16 takes precedence
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 51/06 grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
• CPC Class Codes: C08L 67/04 Polyesters derived from hydroxycarboxylic acids, e.g. lactones C08L67/06 takes precedence
• CPC Class Codes: C09J 11/06 organic
• CPC Class Codes: C09J 133/24 Homopolymers or copolymers of amides or imides
• CPC Class Codes: C09J 151/06 grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
• CPC Class Codes: Y10T 428/2848 Three or more layers
• CPC Class Codes: Y10T 428/2852 Adhesive compositions
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]
• CPC Class Codes: Y10T 428/31909 Next to second addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31928 : Ester, halide or nitrile of addition polymer

Abstract

The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic polyolefin (P) which is solid at 25° C., and also at least one amide (A) of the formula (I) or (II).

These hotmelt adhesive compositions are suitable more particularly for the adhesive bonding of polyolefin films. More particularly it is possible to form assemblies of a substrate (S) and polyolefins bonded with a hotmelt adhesive.

Claims

1. Hotmelt adhesive composition comprising

at least one atactic poly-α

-olefin (APAO) (P1) being solid at 25°

C.,

at least one thermoplastic polyester (TPE) being solid at 25°

C., and

at least one amide (A) of the formula (I) or (II)

2. Hotmelt adhesive composition according to claim 1, wherein the hotmelt adhesive composition further comprises a silane-grafted poly-α

-olefin (P2).

3. Hotmelt adhesive composition according to claim 1, wherein the atactic poly-α

-olefin (APAO) (P1) is a silane-grafted atactic poly-α

-olefin.

4. Hotmelt adhesive composition according to claim 1, wherein R² is an unsaturated C₈-C₂₀-alkyl radical.

5. Hotmelt adhesive composition according to claim 1, wherein R² is a C₈-C₂₂-alkyl radical.

6. Hotmelt adhesive composition according to claim 1, wherein the amide (A) has the formula (I) and R¹ is H.

7. Hotmelt adhesive composition according to claim 1, wherein the amide (A) is selected from the group consisting of lauryl-, myristyl-, palmityl-, stearyl-, arachidyl-, tuberculostearyl-, palmitoleyl-, oleyl-, linoleyl-, linolenyl-, elaeostearyl-, erucyl- and arachidonylamide.

8. Hotmelt adhesive composition according to claim 1, wherein the amide (A) has a melting point of between 40 and 150°

C.

9. Hotmelt adhesive composition according to claim 1, wherein the hotmelt adhesive composition contains an amount of amide (A) of ≧

5% by weight based on the hotmelt adhesive composition.

10. Hotmelt adhesive composition according to claim 1, wherein the thermoplastic polyester (TPE) is a linear polycaprolactone copolyester urethane.

11. Hotmelt adhesive composition according to claim 1, wherein the hotmelt adhesive composition contains an amount of thermoplastic polyester (TPE) of 5%-30% by weight based on the hotmelt adhesive composition.

12. Hotmelt adhesive composition according to claim 1, wherein the hotmelt adhesive composition further comprises at least one catalyst which catalyzes the reaction of silane groups.

13. Hotmelt adhesive composition according to claim 1, wherein the hotmelt adhesive composition contains an amount of thermoplastic polyolefin (P) of ≧

50% by weight based on the hotmelt adhesive composition.

14. A method of bonding, comprising bonding polyolefin films using the hotmelt adhesive composition according to claim 1.

15. The method of claim 14, wherein the hotmelt adhesive is a laminating adhesive.

16. Assembly comprising:

a polyolefin film (PF);

a hotmelt adhesive composition according to claim 1, and

a substrate (S);

the hotmelt adhesive composition, being disposed between the polyolefin film (PF) and the substrate (S).

17. Assembly according to claim 16, wherein the substrate (S) is a fibre material.

18. Assembly according to claim 16, wherein the assembly is an article of industrial manufacture.

19. Method of producing the assembly according to claim 16, comprising:

(i) melting the hotmelt adhesive composition;

(ii) applying the melted hotmelt adhesive composition to the polyolefin film (PF);

(iii) heating the polyolefin film (PF); and

(iv) contacting the substrate (S) with the melted hotmelt adhesive composition.

20. Method according to claim 19, wherein contacting takes place under an applied pressure.

21. Method according to claim 20, wherein the applied pressure is generated by the application of an underpressure in the space between the substrate (S) and the polyolefin film (PF).

22. Method according to claim 20, wherein contacting takes place at an adhesive temperature of 50°

C. or more.

23. Hotmelt adhesive composition according to claim 2, wherein a weight ratio of atactic poly-α

-olefin (APAO) (P1) to silane-grafted poly-α

-olefin (P2) is between 5;

1 and 1;

5.

24. Hotmelt adhesive composition according to claim 2, wherein a weight ratio of atactic poly-α

-olefin (APAO) (P1) to silane-grafted poly-α

-olefin (P2) is between 1;

1 and 1;

4.