Light emitting diode source with protective barrier
First Claim
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1. An apparatus, comprising:
- a substrate having a top surface;
a LED light source attached to the top surface of the substrate;
at least one electrical connector attached to the substrate and electrically connected to the LED light Source;
a potting material disposed on the top surface of the substrate and covering at least a portion of the electrical connector, and metallic traces on the substrate;
an encapsulation material on the top surface of the substrate and covering at least a portion of the LED light source but not on any part of the potting material; and
a barrier on the top surface of the substrate separating the potting material from the LED light source, the barrier having a height that exceeds the maximum thickness of the entire potting material on the substrate, the barrier further separating the potting material and the encapsulation material.
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Abstract
An apparatus having a substrate, an LED light source attached to the substrate, an electrical connector attached to the substrate and electrically connected to the LED light source, a potting material on the substrate and covering at least a portion of the electrical connector; and a barrier separating the potting material from the LED light source, the barrier having a height that exceeds the thickness of the potting material on the substrate.
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Citations
22 Claims
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1. An apparatus, comprising:
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a substrate having a top surface; a LED light source attached to the top surface of the substrate; at least one electrical connector attached to the substrate and electrically connected to the LED light Source; a potting material disposed on the top surface of the substrate and covering at least a portion of the electrical connector, and metallic traces on the substrate; an encapsulation material on the top surface of the substrate and covering at least a portion of the LED light source but not on any part of the potting material; and a barrier on the top surface of the substrate separating the potting material from the LED light source, the barrier having a height that exceeds the maximum thickness of the entire potting material on the substrate, the barrier further separating the potting material and the encapsulation material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 21, 22)
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8. An apparatus, comprising:
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a substrate having a top surface; an LED light source attached to the top surface of the substrate; a barrier surrounding at least at least a portion of the light source on the top surface of the substrate; at least one electrical connector attached to the substrate and electrically connected to the LED light source;
the electrical connector being on the opposite side of the barrier from the LED light source;a potting material disposed on the top surface of the substrate and covering at least a portion of the electrical connector, and metallic traces on the substrate; an encapsulation material disposed on the top surface of the substrate and covering at least a portion of the LED light source; and wherein the barrier has a height that exceeds the maximum thickness of the entire potting material on the substrate; and
wherein the barrier completely separates the potting material and the encapsulation material. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. An apparatus, comprising:
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a substrate having a top surface; an LED light source attached to the top surface of the substrate; at least one electrical connector attached to the substrate and electrically connected to the LED light source; a potting material disposed on the top surface of the substrate and covering at least a portion of the electrical connector, and metallic traces on the substrate; an encapsulation material disposed on the top surface of the substrate and covering at least a portion of the LED light source; and a barrier between the LED light source and the electrical connector, the barrier having a height that exceeds the maximum thickness of the entire potting material on the substrate, and wherein the barrier separates the potting material and the encapsulation material. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification