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Smart integrated semiconductor light emitting system including light emitting diodes and application specific integrated circuits (ASIC)

  • US 8,084,780 B2
  • Filed: 08/13/2009
  • Issued: 12/27/2011
  • Est. Priority Date: 08/13/2009
  • Status: Active Grant
First Claim
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1. A light emitting diode (LED) system comprising:

  • a substrate comprising a plurality of external contacts configured as terminal contacts for electrically connecting the system to an outside world;

    an application specific integrated circuit (ASIC) die mounted to the substrate having a plurality of integrated circuits, a plurality of input ports in electrical communication with the integrated circuits and with the external contacts on the substrate, and at least one output port in electrical communication with the integrated circuits;

    at least one light emitting diode (LED) mounted to the substrate in electrical communication with the output port;

    the substrate, the external contacts and the integrated circuits configured to integrate the application specific integrated circuit (ASIC) die and the light emitting diode (LED) into an electrical assembly configured to transmit input from the outside world to the application specific integrated circuit (ASIC) die for controlling multiple functions of the light emitting diode (LED) and electrical characteristics of the (LED) system.

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