Smart integrated semiconductor light emitting system including light emitting diodes and application specific integrated circuits (ASIC)

• US 8,084,780 B2
• Filed: 08/13/2009
• Issued: 12/27/2011
• Est. Priority Date: 08/13/2009
• Status: Active Grant

• Current Assignee: Semileds Optoelectronics Company Limited (SemiLEDs Inc)
• Original Assignee: Semileds Optoelectronics Company Limited (SemiLEDs Inc)
• Inventors: Chu, Chen-Fu, Chen, Yung Wei, Doan, Trung Tri, Tan, Tien Wei, Liu, Wen-Huang
• Primary Examiner(s): Pert, Evan
• Assistant Examiner(s): Wilson, Scott R
• Application Number:
  US12/540,523
• Publication Number:
  US 20110037082A1
• Time in Patent Office: 866 Days
• Field of Search: 257/81, 257/84, 257/98, 257/99, 257/100, 257/676, 257/E25.032
• US Class Current: 257/100
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 2924/13033 TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H05B 45/30 Driver circuits
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC) on the substrate, and at least one light emitting diode (LED) on the substrate in electrical communication with the application specific integrated circuit (ASIC). The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated system having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions.

Claims

1. A light emitting diode (LED) system comprising:

a substrate comprising a plurality of external contacts configured as terminal contacts for electrically connecting the system to an outside world;

an application specific integrated circuit (ASIC) die mounted to the substrate having a plurality of integrated circuits, a plurality of input ports in electrical communication with the integrated circuits and with the external contacts on the substrate, and at least one output port in electrical communication with the integrated circuits;

at least one light emitting diode (LED) mounted to the substrate in electrical communication with the output port;

the substrate, the external contacts and the integrated circuits configured to integrate the application specific integrated circuit (ASIC) die and the light emitting diode (LED) into an electrical assembly configured to transmit input from the outside world to the application specific integrated circuit (ASIC) die for controlling multiple functions of the light emitting diode (LED) and electrical characteristics of the (LED) system.

2. The system of claim 1 wherein the substrate comprises a semiconductor substrate having a plurality of second integrated circuits formed therein in electrical communication with the integrated circuits on the application specific integrated circuit (ASIC) die.

3. The system of claim 1 wherein the functions include turning on and off, dimming, and safety protecting the light emitting diode (LED).

4. The system of claim 1 wherein the at least one light emitting diode (LED) comprises a plurality of light emitting diodes (LEDs) electrically connected in series or in parallel.

5. The system of claim 1 wherein the at least one light emitting diode (LED) comprises a plurality of light emitting diodes mounted to the semiconductor substrate in electrical communication with the integrated circuits, each light emitting diode configured to produce a different color.

6. The system of claim 1 further comprising a polymer lens on the semiconductor substrate encapsulating the light emitting diode (LED) and the application specific integrated circuit (ASIC) die.

7. The system of claim 6 wherein the polymer lens includes a phosphor layer configured to produce white light.

8. The system of claim 1 wherein the light emitting diode (LED) comprises a phosphor layer configured to produce white light.

9. The system of claim 1 wherein the substrate includes a reflective recess wherein the light emitting diode (LED) and the application specific integrated circuit (ASIC) die are mounted.

10. A light emitting diode (LED) system comprising:

a semiconductor substrate comprising a plurality of semiconductor devices and a plurality of external contacts in electrical communication with the semiconductor devices configured as terminal contacts for electrically connecting the system to an outside world;

an application specific integrated circuit (ASIC) die mounted to the semiconductor substrate having a plurality of input ports in electrical communication with the semiconductor devices and the external contacts, a plurality of integrated circuits in electrical communication with the input ports, and at least one output port in electrical communication with the integrated circuits;

at least one light emitting diode (LED) mounted to the semiconductor substrate in electrical communication with the output port;

the semiconductor substrate, the external contacts, the semiconductor devices on the semiconductor substrate, and the integrated circuits on the application specific integrated circuit (ASIC) die configured to form an integrated LED circuit configured to transmit input from the outside world to the application specific integrated circuit (ASIC) die for controlling multiple functions of the light emitting diode and electrical characteristics of the (LED) system.

11. The system of claim 10 wherein the semiconductor devices comprise an element selected from the group consisting of resistors, diodes (p-n), capacitors, gates, metal-oxide field effect transistors (MOSFET), and flip flops.

12. The system of claim 10 wherein the at least one light emitting diode comprises a plurality of light emitting diodes electrically connected in series and connected to ground.

13. The system of claim 10 wherein the at least one light emitting diode comprises a plurality of light emitting diodes electrically connected in series in a plurality of parallel strings connected to ground.

14. The system of claim 10 wherein the ASIC die includes a Vin port, a dimmer port, a sensing port, an on-off port, a temperature feedback port, and a ground port.

15. The system of claim 10 wherein the at least one output port comprises a plurality of output ports configured to drive a plurality of series connected light emitting diodes.

16. The system of claim 10 wherein the at least one output port comprises a plurality of output ports configured to drive a plurality of parallel strings of series connected light emitting diodes.

17. The system of claim 10 wherein the at least one light emitting diode comprises a plurality of light emitting diodes, each light emitting diode having a different color, and the application specific integrated circuit (ASIC) die includes a serial port write balance for controlling the light emitting diodes.

18. The system of claim 10 wherein the application specific integrated circuit (ASIC) die and the light emitting diode are flip chip are mounted in a chip on board configuration.

19. The system of claim 10 wherein the light emitting diode (LED) includes a polymer lens.

20. The system of claim 10 wherein the light emitting diode (LED) includes a phosphor layer.

21. The system of claim 10 further comprising a polymer lens on the semiconductor substrate encapsulating the light emitting diode (LED) and the application specific integrated circuit (ASIC) die.

22. The system of claim 21 wherein the polymer lens includes a phosphor layer configured to produce white light.

23. The system of claim 21 wherein the light emitting diode (LED) comprises a phosphor layer configured to produce white light.

24. The system of claim 21 wherein the semiconductor substrate includes a reflective recess wherein the light emitting diode (LED) and the application specific integrated circuit (ASIC) die are mounted.