Short gate high power MOSFET and method of manufacture
First Claim
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1. A semiconductor device comprising:
- a substrate of a first conductivity type;
a region of a second conductivity type within the substrate, the region extending from an upper surface of the substrate into the substrate, the second conductivity type opposite the first conductivity type;
a first layer of the first conductivity type over the substrate and the region;
a trench extending into the first layer, a bottom of the trench is within the first layer and directly over the region,a portion of the first layer is intermediate between the bottom of the trench and the region, the portion is a current conducting channel; and
a gate within the trench.
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Abstract
A short gate high power metal oxide semiconductor field effect transistor formed in a trench includes a short gate having gate length defined by spacers within the trench. The transistor further includes a buried region that extends beneath the trench and beyond a corner of the trench, that effectively shields the gate from high drain voltage, to prevent short channel effects and resultantly improve device performance and reliability.
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Citations
14 Claims
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1. A semiconductor device comprising:
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a substrate of a first conductivity type; a region of a second conductivity type within the substrate, the region extending from an upper surface of the substrate into the substrate, the second conductivity type opposite the first conductivity type; a first layer of the first conductivity type over the substrate and the region; a trench extending into the first layer, a bottom of the trench is within the first layer and directly over the region, a portion of the first layer is intermediate between the bottom of the trench and the region, the portion is a current conducting channel; and a gate within the trench. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A vertical field effect transistor comprising:
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a first layer of a first conductivity type; an implanted region of a second conductivity type extending into the first layer, the second conductivity type opposite the first conductivity type; a second layer of the first conductivity type on an upper surface of the first layer and an upper surface of the implanted region; a trench extending into the second layer directly over the implanted region, a portion of the second layer is disposed intermediate between a bottom of the trench and the implanted region, the portion is a current conducting channel; and a gate within the trench. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification