Cleanup method for optics in immersion lithography using sonic device
First Claim
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1. A method used in a liquid immersion lithography apparatus, the method comprising:
- exposing a substrate by projecting an image onto the substrate through an exposure liquid in an exposure operation; and
generating pressure waves in a cleaning liquid between a member of the lithography apparatus and a movable component of the lithography apparatus which is movable below the member, by using a transducer disposed above the movable component, to remove a contaminant from the member in a cleaning operation in which the substrate is not in contact with the cleaning liquid, whereinthe transducer is mounted apart from the movable component and does not move with the movable component, andthe substrate is moved below the member in the exposure operation and the member does not face the substrate in the cleaning operation.
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Abstract
A megasonic immersion lithography exposure apparatus includes an optical transfer chamber for containing an exposure liquid, at least one megasonic plate operably engaging said optical transfer chamber for propagating sonic waves through the exposure liquid, and an optical system provided adjacent to said optical transfer chamber for projecting light through a mask and said exposure liquid and onto a wafer.
288 Citations
17 Claims
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1. A method used in a liquid immersion lithography apparatus, the method comprising:
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exposing a substrate by projecting an image onto the substrate through an exposure liquid in an exposure operation; and generating pressure waves in a cleaning liquid between a member of the lithography apparatus and a movable component of the lithography apparatus which is movable below the member, by using a transducer disposed above the movable component, to remove a contaminant from the member in a cleaning operation in which the substrate is not in contact with the cleaning liquid, wherein the transducer is mounted apart from the movable component and does not move with the movable component, and the substrate is moved below the member in the exposure operation and the member does not face the substrate in the cleaning operation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification