MEMS probe fabrication on a reusable substrate for probe card application

• US 8,089,294 B2
• Filed: 08/05/2008
• Issued: 01/03/2012
• Est. Priority Date: 08/05/2008
• Status: Expired due to Fees

• Current Assignee: Winmems Technologies Co., Ltd.
• Original Assignee: Winmens Technologies Company Limited
• Inventors: Hsu, Tseng-Yang, Lam, Cao Ngoc
• Primary Examiner(s): Hollington, Jermele M
• Assistant Examiner(s): NGUYEN, TRUNG Q
• Application Number:
  US12/186,458
• Publication Number:
  US 20100033201A1
• Time in Patent Office: 1,246 Days
• Field of Search: None
• US Class Current: 324/761.01
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing

Abstract

A Micro-Electro-Mechanical-Systems (MEMS) probe is fabricated on a substrate for use in a probe card. The probe has a bonding surface to be attached to an application platform of the probe card. The bonding surface is formed on a plane perpendicular to a surface of the substrate. An undercut is formed beneath the probe for detachment of the probe from the substrate.

Claims

1. A method comprising:

forming a probe on a substrate using Micro-Electro-Mechanical Systems (MEMS) processing techniques, the probe having a bonding surface to be attached to an application platform of a probe card, the bonding surface formed on a plane perpendicular to a surface of the substrate;

forming an undercut beneath the probe for detachment of the probe from the substrate;

detaching the probe from the substrate by breaking a joint located between a base portion of probe and an anchoring structure on the substrate, wherein detaching the probe from the substrate further comprises;

forming a sacrificial layer on the substrate;

forming the probe and the anchoring structure on the sacrificial layer; and

removing the sacrificial layer beneath the probe without completely removing the sacrificial layer beneath the anchoring structure.

2. The method of claim 1, wherein the anchoring structure has a surface area greater than that of the probe.

3. The method of claim 1, wherein the anchoring structure has a substantially round shape and the probe has a substantially long and narrow shape.

4. The method of claim 1, wherein the probe comprises:

a contact tip to form a contact with a device-under-test, the contact tip sandwiched between two conductive layers of the probe;

a probe body, which comprises;

a tip portion to support the contact tip;

a spring portion; and

the base portion to support the tip portion and the spring portion, the base portion having an exposed broken surface that is formed by detaching the probe with force from the substrate.

5. The method of claim 4, wherein the probe body has thickness variations in its cross sections, the thickness measured in a direction perpendicular to a surface of the substrate.

6. The method of claim 4, wherein the spring portion has one or more curved shapes and a width that varies along a length of the spring portion, with a first end of the spring portion extending to the tip portion and a second end connecting to the base portion.

7. The method of claim 4, wherein the spring portion includes more than one curved springs connected in parallel.

8. The method of claim 4, wherein the spring portion provides a buckling force that has two stages with a stop between the two stages.

9. The method of claim 1, wherein the base portion is corrugated.

10. The method of claim 1, wherein the substrate is reusable for fabricating a next batch of probes.

11. A method comprising:

forming a probe on a substrate using Micro-Electro-Mechanical Systems (MEMS) processing techniques, the probe having a bonding surface to be attached to an application platform of a probe card, the bonding surface formed on a plane perpendicular to a surface of the substrate;

forming an undercut beneath the probe for detachment of the probe from the substrate;

detaching the probe from the substrate by breaking a joint located between a base portion of probe and an anchoring structure on the substrate, wherein detaching the probe from the substrate further comprises;

forming a conductive layer on the substrate;

forming a sacrificial layer on the conductive layer, the sacrificial layer having an opening to expose the conductive layer;

forming the probe and the anchoring structure on the sacrificial layer, the anchoring structure having contact to the conductive layer through the opening; and

removing the sacrificial layer beneath the probe.

12. The method of claim 11, wherein the anchoring structure has a surface area greater than that of the probe.

13. The method of claim 11, wherein the anchoring structure has a substantially round shape and the probe has a substantially long and narrow shape.

14. The method of claim 11, wherein the probe comprises:

a contact tip to form a contact with a device-under-test, the contact tip sandwiched between two conductive layers of the probe;

a probe body, which comprises;

a tip portion to support the contact tip;

a spring portion; and

the base portion to support the tip portion and the spring portion, the base portion having an exposed broken surface that is formed by detaching the probe with force from the substrate.

15. The method of claim 14, wherein the probe body has thickness variations in its cross sections, the thickness measured in a direction perpendicular to a surface of the substrate.

16. The method of claim 14, wherein the spring portion has one or more curved shapes and a width that varies along a length of the spring portion, with a first end of the spring portion extending to the tip portion and a second end connecting to the base portion.

17. The method of claim 14, wherein the spring portion includes more than one curved springs connected in parallel.

18. The method of claim 14, wherein the spring portion provides a buckling force that has two stages with a stop between the two stages.

19. The method of claim 11, wherein the base portion is corrugated.

20. The method of claim 11, wherein the substrate is reusable for fabricating a next batch of probes.