Earphone speaker with ESD protection

• US 8,090,133 B2
• Filed: 10/21/2007
• Issued: 01/03/2012
• Est. Priority Date: 08/07/2007
• Status: Expired due to Fees

• Current Assignee: Cotron Corporation
• Original Assignee: Cotron Corporation
• Inventors: Yang, Bill
• Primary Examiner(s): Qin, Jianchun
• Application Number:
  US11/875,946
• Publication Number:
  US 20090041290A1
• Time in Patent Office: 1,535 Days
• Field of Search: 381/370, 381/412, 381/396, 381/411
• US Class Current: 381/370
• CPC Class Codes: H04R 9/046 Construction
• CPC Class Codes: H04R 9/06 Loudspeakers

Abstract

An earphone speaker including a conductive housing, a micro speaker module, and a circuit board is provided. The conductive housing has a holding space. The micro speaker module is disposed in the holding space. The circuit board is disposed outside the conductive housing, and has a first surface facing towards the conductive housing and a second surface corresponding to the first surface. A positive terminal and a negative terminal are disposed on the second surface and electrically connected to the micro speaker module. A conductive material layer is disposed on the first surface and electrically connected to the negative terminal, and the conductive material layer is directly contacted with the conductive housing.

Claims

1. An earphone speaker, comprising:

a conductive housing, having a holding space;

a micro speaker module, disposed in the holding space; and

a circuit board, disposed outside the conductive housing, having a first surface facing towards the conductive housing and a second surface corresponding to the first surface, wherein a positive terminal and a negative terminal are disposed on the second surface and electrically connected to the micro speaker module, a conductive material layer is disposed on the first surface and electrically connected to the negative terminal, and the conductive material layer is directly contacted with the conductive housing.

2. The earphone speaker as claimed in claim 1, wherein the conductive housing is made of metal.

3. The earphone speaker as claimed in claim 1, further comprising a dust filter disposed on an opening of the conductive housing, so as to seal the holding space.

4. The earphone speaker as claimed in claim 3, wherein the dust filter is made of metal.

5. The earphone speaker as claimed in claim 1, wherein micro speaker module comprises a speaker vibration system and a magnetic loop.

6. The earphone speaker as claimed in claim 5, wherein the speaker vibration system comprises a vibration film and a coil disposed on the vibration film, and the coil surrounds the magnetic loop and is electrically connected to the positive terminal and the negative terminal.

7. The earphone speaker as claimed in claim 5, wherein the magnetic loop comprises a magnet and a polepiece.

8. The earphone speaker as claimed in claim 1, wherein the circuit board further comprises a plated through hole, electrically connected to the negative terminal and the conductive material layer.

9. The earphone speaker as claimed in claim 1, wherein the conductive material layer substantially covers the entire second surface.