Low profile package for an implantable device

• US 8,090,448 B2
• Filed: 09/05/2008
• Issued: 01/03/2012
• Est. Priority Date: 03/24/1999
• Status: Expired due to Fees

• Current Assignee: Second Sight Medical Products, Inc.
• Original Assignee: Second Sight Medical Products, Inc.
• Inventors: Greenberg, Robert J., Schulman, Joseph H.
• Primary Examiner(s): Gedeon, Brian T
• Application Number:
  US12/205,659
• Publication Number:
  US 20090005835A1
• Time in Patent Office: 1,215 Days
• Field of Search: 607/36, 607/53, 607/54
• US Class Current: 607/54
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: A61N 1/36046 of the eye
• CPC Class Codes: A61N 1/37247 User interfaces, e.g. input or presentation means
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

The present invention is a low profile hermetic package for an implantable medical device. The package includes a non-conductive substrate including a plurality of straight conductive vias through the non-conductive substrate. A conductive cover hermetically enclosing an electronics circuit is bonded to the non-conductive substrate. The device is low profile. The width of the non-conductive substrate is grater than the height of the cover.

Claims

1. An implantable medical device comprising:

an electrically non-conductive substrate, having a certain width, including a plurality of electrically conductive vias directly piercing said non-conductive substrate;

an electronic circuit supported by said non-conductive substrate;

an electrically conductive cover, having a certain height perpendicular to said width, bonded to said electrically non-conductive substrate wherein said electrically non-conductive substrate, said electrically conductive vias, and said electrically conductive cover form a hermetic package around said electronic circuit; and

wherein said width is greater than said height and at least one of said electrically conductive vias is configured to transmit electrical signals to or from an electrode.

2. The implantable medical device according to claim 1, wherein said non-conductive substrate is comprised of ceramic.

3. The implantable medical device according to claim 1, wherein said electrically conductive cover is metal.

4. The implantable medical device according to claim 3, wherein said metal cover is brazed to said electrically non-conductive substrate.

5. The implantable medical device according to claim 1, further comprising electrodes bonded to said electrically conductive vias.

6. The implantable medical device according to claim 1, wherein said electronic circuit is flip-chip bonded to said electrically non-conductive substrate.

7. The implantable medical device according to claim 1, wherein said package forms part of a visual prosthesis.

8. An implantable device for a visual prosthesis comprising:

an internal electronics unit, suitable for implantation within a living body, at least a portion of said internal electronics unit is formed within a biocompatible hermetic box including a non-conductive substrate, having a certain width, including a plurality of straight conductive vias directly piercing said non-conductive substrate, a electronic circuit supported by said non-conductive substrate, a conductive cover, having a certain height perpendicular to said width, bonded to said non-conductive substrate wherein said non-conductive substrate, said conductive vias, and said conductive cover form a hermetic package around said electronic circuit, and wherein said width is greater than said height; and

a plurality of electrodes driven by said internal electronics unit suitable for stimulating visual neurons to create a perception of a visual image.

9. The implantable device according to claim 8, wherein said non-conductive substrate is ceramic.

10. The implantable device according to claim 8, wherein said conductive cover is metal.

11. The implantable device according to claim 10, wherein said cover is brazed to said non-conductive substrate.

12. The implantable device according to claim 8, wherein said electronic circuit is flip-chip bonded to said non-conductive substrate.