Method of forming an inlay substrate having an antenna wire
First Claim
1. Method of forming an inlay substrate comprising an antenna wire and a site for a transponder chip, comprising:
- while mounting the antenna wire to a surface of a substrate leaving end portions, exclusive of ends of the antenna wire unmounted and positioned adjacent the site for the transponder chip, wherein the ends of the antenna wire are mounted to the surface of the substrate;
installing the transponder chip at the site for the transponder chip, between the unmounted end portions of the antenna wire; and
repositioning the unmounted end portions of the antenna wire to be directly over terminals of the transponder chip;
wherein the site for the transponder chip comprises a recess in the substrate, and further comprising;
providing slots in the substrate, adjacent opposite sides of the recess;
wherein the antenna is formed by;
passing the antenna wire over a first one of the slots in the substrate along a side of the site for the transponder chip;
routing the antenna wire to form an antenna with a given number of turns; and
passing the antenna wire over a second one of the slots in the substrate along an opposite side of the site for the transponder chip.
2 Assignments
0 Petitions
Accused Products
Abstract
Forming an inlay comprising an antenna wire having two end portions and a site for a transponder chip, comprises: mounting the wire to a surface of substrate; and leaving the end portions of the antenna wire free-standing, as loops adjacent terminal areas of a site on the substrate for the transponder chip. With the transponder chip installed on the substrate, the free-standing loops are repositioned to be substantially directly over the terminals of the transponder chip, in preparation for interconnection of the loops to the terminals of the transponder chip, then are bonded to the terminals. An embedding tool for mounting the wire on the substrate may embed the wire in or adhesively place a self-bonding wire on a surface of the substrate. The substrate may have two transponder chips, and function as a secure inlay. An anti-skimming feature is included in the inlay.
65 Citations
17 Claims
-
1. Method of forming an inlay substrate comprising an antenna wire and a site for a transponder chip, comprising:
-
while mounting the antenna wire to a surface of a substrate leaving end portions, exclusive of ends of the antenna wire unmounted and positioned adjacent the site for the transponder chip, wherein the ends of the antenna wire are mounted to the surface of the substrate; installing the transponder chip at the site for the transponder chip, between the unmounted end portions of the antenna wire; and repositioning the unmounted end portions of the antenna wire to be directly over terminals of the transponder chip; wherein the site for the transponder chip comprises a recess in the substrate, and further comprising; providing slots in the substrate, adjacent opposite sides of the recess; wherein the antenna is formed by; passing the antenna wire over a first one of the slots in the substrate along a side of the site for the transponder chip; routing the antenna wire to form an antenna with a given number of turns; and passing the antenna wire over a second one of the slots in the substrate along an opposite side of the site for the transponder chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. Method of forming an inlay substrate comprising an antenna wire and a site for a transponder chip, comprising:
-
while mounting the antenna wire to a surface of a substrate leaving end portions, exclusive of ends of the antenna wire unmounted and positioned adjacent the site for the transponder chip, wherein the ends of the antenna wire are mounted to the surface of the substrate; installing the transponder chip at the site for the transponder chip, between the unmounted end portions of the antenna wire; and repositioning the unmounted end portions of the antenna wire to be directly over terminals of the transponder chip; wherein the site for the transponder chip comprises terminal areas whereat terminals of the transponder chip will be located, further comprising; at a point on the surface of the substrate, commencing mounting the antenna wire; continuing mounting the antenna wire a short distance; forming a first of the unmounted end portions of the antenna wire in the antenna wire adjacent a first of the terminal areas for the transponder chip; resuming mounting the antenna wire on the substrate with a given number of turns; forming a second of the unmounted end portions of the antenna wire in the antenna wire adjacent a second of the terminal areas for the transponder chip; and continuing mounting the antenna wire a short distance; and severing the wire.
-
Specification