Camera module with premolded lens housing and method of manufacture

• US 8,092,102 B2
• Filed: 05/31/2006
• Issued: 01/10/2012
• Est. Priority Date: 05/31/2006
• Status: Expired due to Fees

• Current Assignee: Flextronics America LLC (Flextronics International Limited)
• Original Assignee: Flextronics America LLC (Flextronics International Limited)
• Inventors: Shangguan, Dongkai, Tam, Samuel Waising
• Primary Examiner(s): Perkey, W. B.
• Assistant Examiner(s): Chang, Fang-Chi
• Application Number:
  US11/444,277
• Publication Number:
  US 20070278394A1
• Time in Patent Office: 2,050 Days
• Field of Search: 396/529, 348/340, 359/819, 257/433
• US Class Current: 396/529
• CPC Class Codes: G03B 17/02 Bodies
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A novel digital camera module includes an image capture device, a circuit substrate, a lens unit and a housing that is mounted to the circuit substrate before the image capture device is mounted to the circuit substrate. In one particular embodiment, the housing is formed onto the circuit substrate via molding. The housing includes a bore to receive the lens unit, with the diameter of the bore being larger than the diagonal of the image capture device such that image capture device can be mounted to the circuit substrate through the bore. In another particular embodiment, the circuit substrate includes an aperture so as to facilitate the flip-chip bonding of the image capture device. The order in which the image capture device and the housing are coupled to the circuit substrate helps prevent damage to the image capture device during the mounting of the housing to the circuit substrate.

Claims

1. A digital camera module comprising:

a pre-fabricated circuit substrate;

a lens housing formed on said pre-fabricated circuit substrate; and

an image capture device coupled to said circuit substrate; and

wherein

said lens housing allows said image capture device to be mounted to said circuit substrate after said lens housing is formed on said circuit substrate;

said lens housing defines a bore adapted to receive a lens unit; and

a diameter of said bore is sized with respect to a longest diagonal of said image capture device such that said bore facilitates lateral positioning of said image capture device on said circuit substrate.

2. The digital camera module according to claim 1, wherein:

said circuit substrate includes a substantially flat top surface; and

said image capture device and said lens housing are affixed to said substantially flat top surface.

3. The digital camera module according to claim 1, wherein said diameter of said bore is nearly the same size as said longest diagonal of said image capture device.

4. A method for manufacturing a camera module comprising:

providing an image capture device;

providing a pre-fabricated circuit substrate;

forming a lens housing on said pre-fabricated circuit substrate; and

mounting said image capture device onto said circuit substrate after said lens housing is formed on said circuit substrate; and

wherein

said step of mounting said image capture device onto said circuit substrate includes mounting said image capture device through a bore in said lens housing, said bore adapted to receive a lens unit; and

a diameter of said bore is sized with respect to a longest diagonal of said image capture device such that said step of mounting said image capture device includes using said bore to laterally position said image capture device on said circuit substrate.

5. The method for manufacturing a camera module according to claim 4, wherein said step of providing a circuit substrate includes providing a circuit substrate having at least one insulating layer and at least one conductive layer.

6. The method for manufacturing a camera module according to claim 5, wherein:

said step of forming said lens housing on said circuit substrate includes molding said lens housing onto said insulating layer such that said lens housing is disposed a spaced distance from at least one electrical contact of said conductive layer; and

said step of mounting said image capture device onto said circuit substrate includes coupling said image capture device to said at least one electrical contact of said conductive layer.

7. The method for manufacturing a camera module according to claim 4, wherein:

said circuit substrate is made of a first material; and

said lens housing is formed from a second material different from said first material.

8. The method for manufacturing a camera module according to claim 4, wherein:

said circuit substrate includes a substantially flat top surface; and

said image capture device and said lens housing are affixed to said substantially flat top surface.

9. A method for manufacturing camera modules comprising:

providing a pre-fabricated circuit substrate having a plurality of individual camera module circuit boards embodied therein;

forming a plurality of housings on said pre-fabricated circuit substrate, each of said housings formed on an associated one of said individual camera module circuit boards;

providing a plurality of image capture devices; and

mounting a respective one of said image capture devices onto each of said individual camera module circuit boards, each of said image capture devices being mounted on an associated one of said camera module circuit boards after one of said housings is formed on said associated camera module circuit board; and

wherein

said step of mounting said respective one of said image capture devices onto each of said individual camera module circuit boards includes mounting said respective one of said image capture devices through a bore in said housing, said bore adapted to receive a lens unit; and

a diameter of said bore is sized with respect to a longest diagonal of said respective one of said image capture devices such that said step of mounting said respective one of said image capture devices includes using said bore to laterally position said respective one of said image capture device on said associated one of said camera module circuit boards.

10. The method for manufacturing camera modules according to claim 9, wherein each of said individual camera module circuit boards include at least one insulating layer and at least one conductive layer.

11. The method for manufacturing camera modules according to claim 10, wherein:

said step of forming said plurality of housings on said circuit substrate includes molding each of said housings onto said insulating layer of said respective one of said individual camera module circuit boards such that each said housing is disposed a spaced distance from at least one electrical contact of said conductive layer of said respective individual camera module circuit board; and

said step of mounting said respective one of said image capture devices onto each of said individual camera module circuit boards includes coupling said respective one of said image capture devices to said at least one electrical contact of said conductive layer of said respective one of said individual camera module circuit boards.