Plasma processing apparatus

• US 8,092,642 B2
• Filed: 02/25/2009
• Issued: 01/10/2012
• Est. Priority Date: 02/26/2008
• Status: Expired due to Fees

• Current Assignee: Tohoku University National Universities Corporation, Tokyo Electron Limited
• Original Assignee: Tohoku University National Universities Corporation, Tokyo Electron Limited
• Inventors: Hongo, Toshiaki, Hirayama, Masaki, Ohmi, Tadahiro
• Primary Examiner(s): DHINGRA, RAKESH KUMAR
• Application Number:
  US12/392,133
• Publication Number:
  US 20090214400A1
• Time in Patent Office: 1,049 Days
• Field of Search: 156/345.41, 118/723.MW, 118/723.AN
• US Class Current: 156/345.41
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence
• CPC Class Codes: H01J 37/3222 Antennas
• CPC Class Codes: H01J 37/32238 Windows

Abstract

Provided is a plasma processing apparatus capable of generating a uniform plasma by preventing a nonuniformity of a current flow in a slot antenna. A dielectric plate is disposed to close a top opening of a plate cover and a slot antenna for generating plasma is disposed on the dielectric plate. By allowing an outer periphery of the slot antenna to make direct contact with an inner wall portion of the plate cover by using a conductive member having elasticity, when a microwave is supplied to slot antenna, it is possible to make an electrical resistance between the inner wall portion of the processing vessel and the outer periphery of the flat plate antenna substantially the same at any point in the entire circumference of the processing vessel, so that magnitude of the microwave current flowing in the slot antenna can be made approximately the same.

Claims

1. A plasma processing apparatus comprising:

a processing vessel which has a top opening and is made of metal;

a dielectric plate disposed to close the top opening of the processing vessel;

a microwave supply source of which ground side is connected with the processing vessel, for supplying a microwave;

a flat plate slot antenna which is installed on top of the dielectric plate, for supplying the microwave from the microwave supply source to an inside of the processing vessel by transmitting it through the dielectric plate and generating plasma inside the processing vessel; and

a conductive member which makes direct contact between substantially an entire circumference of the inner wall of the processing vessel and an outer periphery of the flat plate slot antenna,

wherein the microwave flows from the flat plate slot antenna to the inner wall portion of the processing vessel via the conductive member, so that the microwave flowing in the flat plate slot antenna is allowed to be uniform.

2. The plasma processing apparatus of claim 1, wherein the conductive member is installed at the flat plate slot antenna and elastically makes contact with the inner wall portion of the processing vessel over substantially an entire circumference of the processing vessel.

3. The plasma processing apparatus of claim 2, wherein the conductive member has a ring shape and includes a contact piece which extends from an outer periphery portion of the conductive member toward an outer side in a diametrical direction and an upper side so as to elastically make contact with the inner wall portion of the processing vessel.

4. The plasma processing apparatus of claim 2, further comprising:

a cover member covering the flat plate slot antenna,

wherein the flat plate slot antenna is fixed to the cover member by a screw, and the conductive member is fixed to the cover member together with the flat plate slot antenna by the screw.

5. The plasma processing apparatus of claim 4, wherein the conductive member has a ring shape and includes a contact piece which extends from an outer periphery portion of the conductive member toward an outer side in a diametrical direction and an upper side so as to elastically make contact with the inner wall portion of the processing vessel.

6. The plasma processing apparatus of claim 1, further comprising:

a cover member covering the flat plate slot antenna,

wherein the conductive member is held by the cover member and elastically makes contact with both the inner wall portion of the processing vessel and the flat plate slot antenna.

7. The plasma processing apparatus of claim 6, wherein the conductive member has a ring shape which is formed by winding a metal strip having a predetermined width in a spiral shape,

the cover member includes a groove for fitting and inserting the conductive member thereinto, and

the conductive member is fitted and inserted into the groove, thereby elastically making contact with the flat plate slot antenna and the inner wall portion of the processing vessel.