Manufacturing method of semiconductor device

• US 8,092,703 B2
• Filed: 06/12/2007
• Issued: 01/10/2012
• Est. Priority Date: 06/12/2006
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Electronics Corporation
• Inventors: Ishibashi, Takeo, Yonekura, Kazumasa, Tadokoro, Masahiro, Yoshikawa, Kazunori, Ono, Yoshiharu
• Primary Examiner(s): Norton, Nadine G
• Assistant Examiner(s): DUCLAIR, STEPHANIE P.
• Application Number:
  US11/808,650
• Publication Number:
  US 20070287298A1
• Time in Patent Office: 1,673 Days
• Field of Search: None
• US Class Current: 216/41
• CPC Class Codes: H01L 21/0332 characterised by their composition, e.g. multilayer masks, materials
• CPC Class Codes: H01L 21/0337 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
• CPC Class Codes: H01L 21/31058 of organic layers
• CPC Class Codes: H01L 21/31144 using masks
• CPC Class Codes: H01L 21/31155 by ion implantation
• CPC Class Codes: H01L 21/76808 involving intermediate temporary filling with material
• CPC Class Codes: H01L 21/76825 by exposing the layer to particle radiation, e.g. ion implantation, irradiation with UV light or electrons etc. plasma treatment H01L21/76826
• CPC Class Codes: H01L 21/76826 by contacting the layer with gases, liquids or plasmas

Abstract

It is an object of the present invention to provide a method of manufacturing a semiconductor device that reduces the deterioration in processed configuration and the pattern roughness of a film to be processed, and is close to the original design and applicable to a dual damascene step and the like. The manufacturing method comprises a processing mask layer forming step of forming a processing mask layer (a lower organic film and a middle layer) comprising at least one film, and hardening treatment for at least one film of the processing mask layer by applying a film and heat hardening treatment; a processing mask layer etching step of applying a resist film for exposure to the processing mask layer, exposing and developing it to form a resist pattern, and etching the processing mask layer using the resist pattern as a mask; and a film to be processed etching step of etching the film to be processed using the pattern of the processing mask layer formed at the processing mask layer etching step as a mask.

Claims

1. A manufacturing method of a semiconductor device comprising:

a processing mask layer forming step of forming a processing mask layer comprising at least one layer applied on a target layer and hardened by a heat hardening treatment, and performing hardening treatment for at least one layer in said processing mask layer;

a processing mask layer etching step of applying a resist layer for exposure to said processing mask layer after the processing mask layer forming step, exposing and developing the resist layer to form a resist pattern, and etching said processing mask layer using said resist pattern as a mask; and

a target layer etching step of etching said target layer using a pattern of said processing mask layer formed at said processing mask layer etching step as a mask, and wherein the hardening treatment uses an implantation process for implanting a predetermined atom, a reducing plasma treatment, or a treatment for applying UV or electron beam.

2. The manufacturing method of the semiconductor device according to claim 1, wherein

said processing mask layer comprises only one organic layer applied and thermally hardened.

3. The manufacturing method of the semiconductor device according to claim 1, wherein

said processing mask layer comprises a multilayer comprising a middle layer containing silicon oxide and an organic layer applied and thermally hardened.

4. The manufacturing method of the semiconductor device according to claim 3, wherein

said middle layer forming step forms said middle layer by applying a silsesquoxane derivative polymer and thermally hardening the silsesquoxane derivative polymer.

5. The manufacturing method of the semiconductor device according to claim 1, wherein:

said processing mask layer forming step applies a lower organic layer on said target layer and thermally hardens said lower organic layer, forms a middle layer containing silicon oxide on said lower organic layer, and performs the hardening treatment for at least one of said lower organic layer and said middle layer;

said processing mask layer etching step etches said middle layer using said resist pattern as a mask and etches said lower organic layer using a pattern of said middle layer formed by etching as a mask; and

said target layer etching step etches said target layer using the pattern of said lower organic formed at said processing mask layer etching step as a mask.

6. The manufacturing method of the semiconductor device according to claim 5, comprising a step of performing said hardening treatment for said lower organic layer after said lower organic layer has been formed.

7. The manufacturing method of the semiconductor device according to claim 5, comprising a step of performing said hardening treatment for at least one of said lower organic layer and said middle layer after said middle layer has been formed.

8. The manufacturing method of the semiconductor device according to claim 5, comprising a step of performing said hardening treatment for said lower organic layer after said lower organic layer has been formed, and a step of performing said hardening treatment for said middle layer after said middle layer has been formed.

9. The manufacturing method of the semiconductor device according to claim 5, wherein

processes for forming said lower organic layer, forming said middle layer, and performing said hardening treatment using reducing plasma treatment or UV light irradiation treatment are sequentially performed in a same equipment.

10. The manufacturing method of the semiconductor device according to claim 1, wherein

said reducing plasma treatment performs plasma treatment using hydrogen gas.

11. The manufacturing method of the semiconductor device according to claim 1, wherein the target layer includes a lower dielectric layer.

12. The manufacturing method of the semiconductor device according to claim 11, wherein

said hardening treatment adjusts a thickness of a hardened layer by varying a process condition.

13. The manufacturing method of the semiconductor device according to claim 11, wherein

said hardening treatment prevents reflection coefficient from a hardened layer to said resist pattern by varying a process condition.

14. The manufacturing method of the semiconductor device according to claim 1, wherein an upper portion of one layer in the processing mask layer is harder than a lower portion of one layer in the processing mask layer after the processing mask layer forming step.

15. The manufacturing method of the semiconductor device according to claim 14, wherein

said plasma treatment adjusts a thickness of a hardened layer by varying a high frequency power applied to a lower electrode as one process condition.

16. The manufacturing method of the semiconductor device according to claim 1, wherein a via hole is formed in the target layer before the processing mask layer forming step.

17. A manufacturing method of a semiconductor device forming a dual damascene structure on a semiconductor substrate comprising:

an opening step of opening a via hole in a low dielectric layer formed on a lower wiring layer;

a lower organic layer forming step of applying a lower organic layer on said low dielectric layer and burying said lower organic layer in said via hole;

a middle layer forming step of forming a middle layer containing silicon oxide on said lower organic layer;

a resist pattern forming step of applying a resist layer on the middle layer and exposing and developing the resist layer to form a resist pattern of a trench;

a middle layer etching step of etching said middle layer using said resist pattern as a mask;

a lower organic layer etching step of etching said lower organic layer using a pattern of said middle layer formed at said middle layer etching step as a mask;

a trench forming step of etching said low dielectric layer using a pattern of said lower organic layer formed at said lower organic layer etching step as a mask and forming said trench having a depth not reaching a bottom of said via hole; and

a wiring layer forming step of removing a film existing in said via hole on said lower wiring layer and burying a wiring layer material in said via hole and said trench, wherein

a hardening treatment is performed for at least one of said lower organic layer and said middle layer before the resist pattern forming step, and wherein the hardening treatment uses an implantation process for implanting a predetermined atom, a reducing plasma treatment, or a treatment for applying UV treatment or electron beam.

18. The manufacturing method of the semiconductor device according to claim 17, wherein

said hardening treatment hardens an upper part of said lower organic layer more than a part of said lower organic layer buried in said via hole by adjusting a process condition.