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Electrically conductive interconnect system and method

  • US 8,093,729 B2
  • Filed: 07/16/2007
  • Issued: 01/10/2012
  • Est. Priority Date: 06/14/2005
  • Status: Expired due to Fees
First Claim
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1. An interconnect for electrically connecting integrated circuit chips, the interconnect comprising:

  • a post extending above a first supporting surface of an integrated circuit chip, wherein the post includes;

    a rigid material comprising an end portion opposite the first supporting surface;

    a first electrically-conductive coating adhered to the rigid material and positioned over the end portion; and

    a second electrically-conductive coating adhered to the first coating and positioned over the end portion; and

    an electrically-conductive material surrounding at least a portion of the post and positioned over the end portion of the rigid material, wherein the electrically-conductive material comprises a malleable material that is more malleable than the rigid material, and wherein the electrically-conductive material is different than the second electrically-conductive coating;

    wherein the post has a first portion having a first width at the first supporting surface and a second portion having a second width at a distance from the first supporting surface, and wherein the second width is less than the first width.

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