Semiconductor switching module optimized for resistance to short circuits

• US 8,093,975 B2
• Filed: 09/04/2007
• Issued: 01/10/2012
• Est. Priority Date: 09/08/2006
• Status: Active Grant

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Meier, Markus, Viala, Bertrand, Jonas, Stephan
• Primary Examiner(s): Chen, Xiaoliang
• Assistant Examiner(s): MILAKOVICH, NATHAN J
• Application Number:
  US11/896,561
• Publication Number:
  US 20080061912A1
• Time in Patent Office: 1,589 Days
• Field of Search: 361/667, 335/202
• US Class Current: 335/202
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars

Abstract

A semiconductor switching module including a housing having openings to remove pressure which occurs during a short circuit. The housing openings, which can be sealed by thin walls dimensioned so that so that parts which carry current cannot be touched from outside and the walls can be destroyed or removed by the pressure which occurs during a short circuit.

Claims

1. A semiconductor switching module, comprising:

a housing, the housing including openings, which are sealed by thin walls during normal operation of the semiconductor switching module, to carry away pressure which occurs in a case of a short circuit, the thin walls being dimensioned to be at least one of destroyed and removed by the pressure which occurs in the case of a short circuit, and the openings being further dimensioned so that parts which carry current cannot be touched from outside of the semiconductor switching module.

2. The semiconductor switching module as claimed in claim 1, wherein at least one outer wall of the semiconductor switching module is in the form of part of the housing.

3. The semiconductor switching module as claimed in claim 1, wherein the semiconductor switching module is implemented as a power module with direct copper bonding.

4. The semiconductor switching module as claimed in claim 1, wherein the housing is made of insulating plastic.

5. The semiconductor switching module as claimed in claim 1, wherein the thin walls are implemented as adhesive labels.

10. The semiconductor switching module as claimed in claim 2, wherein the semiconductor switching module is implemented as a power module with a direct copper bonding.

11. The semiconductor switching module as claimed in claim 2, wherein the housing is made of insulating plastic.

12. The semiconductor switching module as claimed in claim 2, wherein the thin walls are implemented as adhesive labels.

15. The semiconductor switching module as claimed in claim 1, wherein the semiconductor switching module is one of a circuit breaker or a fuse.

6. A housing for a semiconductor switching module, comprising:

openings, sealable by thin walls, to carry away pressure which occurs in the case of a short circuit, the walls being dimensioned to be destroyed by the pressure which occurs in a case of a short circuit, and the openings being dimensioned so that parts which carry current cannot be touched from outside of the semiconductor switching module.

7. The housing as claimed in claim 6, wherein part of the housing is in the form of at least one outer wall of the semiconductor switching module.

8. The housing as claimed in claim 6, wherein the housing is made of insulating plastic.

9. The housing as claimed in claim 6, wherein the thin walls are implemented as adhesive labels.

13. The housing as claimed in claim 7, wherein the housing is made of insulating plastic.

14. The housing as claimed in claim 7, wherein the thin walls are implemented as adhesive labels.