Silica-on-silicon waveguides and related fabrication methods

• US 8,094,987 B2
• Filed: 02/23/2011
• Issued: 01/10/2012
• Est. Priority Date: 05/19/2008
• Status: Active Grant

• Current Assignee: California Institute of Technology
• Original Assignee: California Institute of Technology
• Inventors: Martin Armani, Andrea
• Primary Examiner(s): PAK, SUNG H
• Application Number:
  US13/033,391
• Publication Number:
  US 20110138860A1
• Time in Patent Office: 321 Days
• Field of Search: None
• US Class Current: 385/129
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: G02B 2006/12038 Glass (SiO2 based materials)
• CPC Class Codes: G02B 2006/12119 Bend
• CPC Class Codes: G02B 6/1223 high refractive index type, i.e. high-contrast waveguides
• CPC Class Codes: G02B 6/13 Integrated optical circuits characterised by the manufacturing method
• CPC Class Codes: G02B 6/2861 using fibre optic delay lines and optical elements associated with them, e.g. for use in signal processing, e.g. filtering delay lines in general H03H, H01P9/00; optical computing devices G06E

Abstract

True time delay silica waveguides and related fabrication methods are disclosed. Also disclosed are true time delay silica waveguides comprising wedged silica structures.

Claims

1. A method for fabricating a silica waveguide, comprising:

defining a substantially polygonal silica pad on a silicon substrate;

forming a pillar under the silica pad, thus suspending the silica pad on the silicon substrate;

performing a laser silica reflow process on the suspended silica pad; and

, after that,

cleaving at least one of the sides of the suspended silica pad to define at least one non-resonant waveguide structure with a substantially circular cross section.

2. The method of claim 1, wherein the performing the laser silica reflow process on the suspended silica pad defines a substantially ovally shaped silica pad, and wherein cleaving at least one of the sides of the suspended silica pad comprises cleaving one side of the suspended silica pad to define a single, substantially C-shaped, waveguide structure with a substantially circular cross section.

3. The method of claim 1, wherein the performing the laser silica reflow process on the suspended silica pad defines a substantially ovally shaped silica pad, and wherein cleaving at least one of the sides of the suspended silica pad comprises cleaving two sides of the silica pad to define two separate waveguide structures, each waveguide structure having a substantially circular cross section.

4. The method of claim 1, wherein the polygonal silica pad is a rectangular or square silica pad.

5. The method of claim 1, wherein the substantially polygonal silica pad is defined through etching.

6. The method of claim 1, wherein the laser silica reflow process is performed by movement of the silica pad through a laser beam.

7. The method of claim 1, wherein the laser silica reflow process is performed by movement of a laser beam through the silica pad.

8. The method of claim 1, wherein the two waveguide structures extend along a curved path.

9. The method of claim 3, wherein the two separate waveguide structures are parallel to each other.