Physical quantity sensor and method for manufacturing the same
First Claim
1. A physical quantity sensor, comprising:
- two substrates; and
a movable electrode that is disposed between the two substrates and is bonded to the two substrates, whereinthe movable electrode is provided with an elastically deformable diaphragm,at least one of the two substrates is an electrode substrate having one or more detection electrodes on a surface opposite to the diaphragm to detect a change in capacitance between the diaphragm and the detection electrode, and wherein,in a range between a room temperature and a bonding temperature when the two substrates are bonded to the movable electrode, coefficients of thermal expansion of the two substrates are smaller than a coefficient of thermal expansion of the movable electrode, and,the two substrates are a first substrate and a second substrate having different coefficients of thermal expansion with each other in a temperature range where the physical quantity sensor is used, the coefficient of thermal expansion of the movable electrode being between the coefficients of thermal expansion of the first substrate and the second substrate in a temperature range where the physical quantity sensor is used.
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Abstract
A physical quantity sensor includes two substrates and a movable electrode that is disposed between the two substrates and is bonded to the two substrates. In the physical quantity sensor, the movable electrode has an elastically deformable diaphragm and one of the two substrates is an electrode substrate having a detection electrode on a detection surface opposite to the diaphragm to detect capacitance between the diaphragm and the detection electrode. In the physical quantity sensor, in a range between a room temperature and a bonding temperature when the two substrates and the movable electrode are bonded, coefficients of thermal expansion of the two substrates are smaller than that of the movable electrode and in a temperature range where the physical quantity sensor is used, a coefficient of thermal expansion of the movable electrode is between a first and second substrates.
16 Citations
6 Claims
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1. A physical quantity sensor, comprising:
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two substrates; and a movable electrode that is disposed between the two substrates and is bonded to the two substrates, wherein the movable electrode is provided with an elastically deformable diaphragm, at least one of the two substrates is an electrode substrate having one or more detection electrodes on a surface opposite to the diaphragm to detect a change in capacitance between the diaphragm and the detection electrode, and wherein, in a range between a room temperature and a bonding temperature when the two substrates are bonded to the movable electrode, coefficients of thermal expansion of the two substrates are smaller than a coefficient of thermal expansion of the movable electrode, and, the two substrates are a first substrate and a second substrate having different coefficients of thermal expansion with each other in a temperature range where the physical quantity sensor is used, the coefficient of thermal expansion of the movable electrode being between the coefficients of thermal expansion of the first substrate and the second substrate in a temperature range where the physical quantity sensor is used. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification
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- Resources
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Current AssigneeNagano Keiki Company Limited
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Original AssigneeNagano Keiki Company Limited
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InventorsUehara, Daiji, Kobayashi, Yoichi
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Primary Examiner(s)Caputo, Lisa
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Assistant Examiner(s)JENKINS, JERMAINE L
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Application NumberUS12/419,656Publication NumberTime in Patent Office1,015 DaysField of SearchNoneUS Class Current73/724CPC Class CodesG01L 9/0073 using a semiconductive diap...Y10T 156/1052 with cutting, punching, tea...
