Nonplanar faceplate for a plasma processing chamber

• US 8,097,082 B2
• Filed: 04/28/2008
• Issued: 01/17/2012
• Est. Priority Date: 04/28/2008
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Zhou, Jianhua, Padhi, Deenesh, Janakiraman, Karthik, Yu, Hang, Cheng, Siu F., Summan, Tersem, Saripalli, Yoganand
• Primary Examiner(s): Kornakov, Michael
• Assistant Examiner(s): Bratland, Jr., Kenneth A
• Application Number:
  US12/110,879
• Publication Number:
  US 20090269512A1
• Time in Patent Office: 1,359 Days
• Field of Search: 427/569, 427/575, 118/723.I, 117/200
• US Class Current: 117/200
• CPC Class Codes: C23C 16/5096 Flat-bed apparatus
• CPC Class Codes: H01J 37/32541 Shape
• CPC Class Codes: Y10T 117/10 Apparatus

Abstract

A method and apparatus for adjust local plasma density during a plasma process. One embodiment provides an electrode assembly comprising a conductive faceplate having a nonplanar surface. The nonplanar surface is configured to face a substrate during processing and the conductive faceplate is disposed so that the nonplanar surface is opposing a substrate support having an electrode. The conductive faceplate and the substrate support form a plasma volume. The nonplanar surface is configured to adjust electric field between the conductive plate and the electrode by varying a distance between the conductive plate and the electrode.

Claims

1. An electrode assembly for processing a substrate, comprising:

a conductive faceplate having a nonplanar surface configured to face the substrate during processing, wherein the conductive faceplate is disposed so that the nonplanar surface is opposing a substrate support having an electrode, the conductive faceplate and the substrate support form a plasma volume, a RF power source is applied between the conductive faceplate and the electrode, and the nonplanar surface is configured to reduce density of the electric field near an edge region of the substrate, the non planar surface of the conductive faceplate comprises;

an inner planar portion corresponding to a center portion of the substrate;

a recess outward to the planar portion and corresponding to the edge region of the substrate; and

an outer planar portion outward to the recess, wherein the recess is smoothly connected to the inner planar portion and outer planar portion without corners, the recess is formed from an inner slope and an outer slope, the inner slope is outwardly initiated from the inner planar portion, the outer slope is inwardly initiated from the outer planar portion, the inner and outer slopes meet at a bottom of the recess, the recess having a maximum depth of about 0.5 mm to about 2 mm at a radius of about 130 mm to about 140 mm from a center of the conductive faceplate, the inner slope is initiated at a radius of about 80 mm to about 100 mm, and the outer slope is initiated at a radius of about 140 mm to about 145 mm.

2. The electrode assembly of claim 1, wherein the conductive faceplate has a plurality of gas distributing holes formed therethrough.

3. The electrode assembly of claim 1, further comprising a gas distribution plate coupled to the conductive faceplate on an opposite side of the nonplanar surface, wherein the gas distribution plate and the conductive faceplate are sealingly connected at an edge region, an inner volume is formed between the gas distribution plate and the conductive faceplate, and the conductive faceplate has a plurality of gas distributing holes in fluid communication with the inner volume.

4. The electrode assembly of claim 3, wherein the gas distribution plate comprises:

a gas box having an inlet port configured to receive a processing gas; and

a blocker plate attached to the gas box and facing the conductive faceplate, wherein the blocker plate has a plurality of through holes configured to provide fluid communication between the inlet port and the inner volume.

5. The electrode assembly of claim 1, wherein the nonplanar surface comprises a concaved portion configured to reduce density of a local electric field.

6. The electrode assembly of claim 1, wherein the nonplanar surface comprises a convex portion configured to increase density of a local electric field.

7. An apparatus for processing a substrate, comprising:

a chamber body having sidewalls;

a substrate support disposed in the chamber body and configured to support the substrate, wherein the substrate support comprises an electrode;

a lid assembly disposed on the sidewalls of the chamber body, wherein the lid assembly and the substrate support define a plasma volume, and the lid assembly comprises a conductive faceplate having a nonplanar surface facing the substrate support; and

a RF power source coupled to one of the conductive faceplate or the electrode and configured to generate a plasma within the plasma volume,

wherein the nonplanar surface is configured to reduce density of the electric field near an edge region of the substrate, the non planar surface of the conductive faceplate comprises;

an inner planar portion corresponding to a center portion of the substrate;

a recess outward to the planar portion and corresponding to the edge region of the substrate; and

an outer planar portion outward to the recess, wherein the recess is smoothly connected to the inner planar portion and outer planar portion without corners, the recess is formed from an inner slope and an outer slope, the inner slope is outwardly initiated from the inner planar portion, the outer slope is inwardly initiated from the outer planar portion, the first and second slopes meet at a bottom of the recess, the recess having a maximum depth of about 0.5 mm to about 2 mm at a radius of about 130 mm to about 140 mm from a center of the conductive faceplate, the inner slope is initiated at a radius of about 80 mm to about 100 mm, and the outer slope is initiated at a radius of about 140 mm to about 145 mm.

8. The apparatus of claim 7, wherein the recess is circular, and a ratio of a radius of recess and the radius of the substrate is between about 13:

15 to about 14;

15.

9. The apparatus of claim 7, wherein the conductive faceplate has a plurality of gas distributing holes formed therethrough and configured to distribute a processing gas to the plasma volume.

10. The apparatus of claim 9, wherein the lid assembly further comprises:

a gas distribution plate coupled to the conductive faceplate on an opposite side of the nonplanar surface, wherein the gas distribution plate and the conductive faceplate are sealingly connected at an edge region, an inner volume is formed between the gas distribution plate and the conductive faceplate, and the inner volume is in fluid communication with the plasma volume through the plurality of gas distributing holes of the conductive face plate.

11. The apparatus of claim 10, wherein the gas distribution plate comprises:

a gas box having an inlet port configured to receive a processing gas; and

a blocker plate attached to the gas box and facing the conductive faceplate, wherein the blocker plate has a plurality of through holes configured to provide fluid communication between the inlet port and the inner volume.

12. A method for processing a substrate, comprising:

positioning the substrate on a substrate support disposed in a processing chamber, wherein the substrate support has an electrode;

supplying a processing gas to the processing chamber; and

generating a plasma of the processing gas by applying a RF power between the electrode of the substrate support and a conductive faceplate disposed above the substrate, wherein the conductive faceplate has a nonplanar surface configured to reduce density of the electric field near an edge region of the substrate, the non planar surface of the conductive faceplate comprises;

an inner planar portion corresponding to a center portion of the substrate;

a recess outward to the planar portion and corresponding to the edge region of the substrate; and

an outer planar portion outward to the recess, wherein the recess is smoothly connected to the inner planar portion and outer planar portion without corners, the recess is formed from an inner slope and an outer slope, the inner slope is outwardly initiated from the inner planar portion, the outer slope is inwardly initiated from the outer planar portion, the inner and outer slopes meet at a bottom of the recess, the recess having a maximum depth of about 0.5 mm to about 2 mm at a radius of about 130 mm to about 140 mm from a center of the conductive faceplate, the inner slope is initiated at a radius of about 80 mm to about 100 mm, and the outer slope is initiated at a radius of about 140 mm to about 145 mm.

13. The method of claim 12, wherein the nonplanar surface comprises a recess corresponding to an edge portion of the substrate.

14. The method of claim 12, wherein generating the plasma comprises using a conductive faceplate having a concaved portion to reduce local plasma density.

15. The method of claim 12, wherein generating the plasma comprises using a conductive faceplate having a convex portion to increase local plasma density.

16. The method of claim 12, wherein supplying the processing gas comprises flowing a process gas from a plurality of gas distribution holes formed through the conductive faceplate.