Integrated circuit chip design flow methodology including insertion of on-chip or scribe line wireless process monitoring and feedback circuitry

• US 8,097,474 B2
• Filed: 12/24/2008
• Issued: 01/17/2012
• Est. Priority Date: 03/24/2008
• Status: Active Grant

• Current Assignee: Marvell Asia Pte Limited (Marvell Technology Group Limited)
• Original Assignee: International Business Machines Corporation
• Inventors: Anemikos, Theodoros, Hall, Ezra D. B., Ventrone, Sebastian T.
• Primary Examiner(s): Sefer, A.
• Assistant Examiner(s): Harrison, Monica D
• Application Number:
  US12/343,686
• Publication Number:
  US 20090239313A1
• Time in Patent Office: 1,119 Days
• Field of Search: 716100-110, 438/5, 257/E21.525
• US Class Current: 438/5
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G06F 2119/18 Manufacturability analysis or optimisation for manufacturability
• CPC Class Codes: G06F 30/30 Circuit design
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

Disclosed are embodiments of a design and manufacturing system and an associated method that allow for design analysis and for insertion, during wafer manufacture, of intra-process monitoring circuitry. These embodiments use a library of pre-qualified intra-process monitoring circuits and a cross-correlation table that links different monitoring circuits with different IC chip components. Specifically, these embodiments analyze integrated circuit chip design data to identify the components designed into the chip. Then, one or more intra-process monitoring circuits are selected from the library and the design data is modified to include the selected monitoring circuit(s).

Claims

1. A system for designing and manufacturing an integrated circuit chip, said system comprising:

an analyzer receiving design data representative of a design of an integrated circuit chip, said design comprising a plurality of integrated circuit chip components and said analyzer further analyzing said data to identify said components;

a library comprising a set of pre-qualified intra-process monitoring circuits; and

a design data editor modifying said design data to incorporate at least one intra-process monitoring circuit selected from said library in order to allow intra-process monitoring of at least one process-dependent parameter of at least one of said components of said integrated circuit chip during fabrication of a wafer that comprises multiple instances of said integrated circuit chip, said process-dependent parameter comprising any one of an electrical parameter and a physical parameter of said at least one of said components.

2. The system of claim 1, further comprising a test program generator generating an extension to a test program in order to monitor, during said fabrication of said wafer, said at least one parameter using said at least one intra-process monitoring circuit.

3. The system of claim 2, further comprising a routing instructions generator modifying routing instructions for said fabrication of said wafer so as to incorporate said extension.

4. The system of claim 2, further comprising a process controller, said process controller adjusting at least one process step based on results obtained from performance of said extension, during said fabrication.

5. The system of claim 1, said design data comprising at least one of an integrated circuit layout and a netlist.

6. The system of claim 1, further comprising any one of the following:

a monitoring circuit selector automatically selecting said at least one intra-process monitoring circuit based on predetermined criteria; and

a user interface allowing a user to select said at least one intra-process monitoring circuit.

7. The system of claim 6,

said library further comprising a cross-correlation table that correlates different integrated circuit chip components with different pre-qualified intra-process monitoring circuits, and

one of said user and said selector accessing said cross-correlation table to identify a sub-set of said pre-qualified intra-process monitoring circuits that have been correlated to a particular component and selecting said at least one intra-process monitoring circuit from said sub-set.

8. The system of claim 7, said selecting of said at least one intra-process monitoring circuit from said sub-set being based on a desired parameter to be monitored.

9. The system of claim 7, said selecting of said at least one intra-process monitoring circuit from said sub-set being based on one of available area on-chip and available area within scribe lines.

10. The system of claim 7, said at least one intra-process monitoring circuit comprising one of an on-chip circuit and a within scribe line circuit.

11. An integrated circuit chip design flow method comprising:

analyzing design data, said design data being representative of a design of an integrated circuit chip comprising a plurality of integrated circuit chip components and said analyzing comprising identifying said components;

selecting at least one intra-process monitoring circuit from a library, said library comprising a set of pre-qualified intra-process monitoring circuits; and

modifying said design data to incorporate said at least one intra-process monitoring circuit in order to allow intra-process monitoring of at least one process-dependent parameter of at least one of said components of said integrated circuit chip during fabrication of a wafer that comprise multiple instances of said integrated circuit chip, said process-dependent parameter comprising any one of an electrical parameter and a physical parameter of said at least one of said components.

12. The method of claim 11, said design data comprising at least one of an integrated circuit layout and a netlist.

13. The method of claim 11, said library further comprising a cross-correlation table that correlates different integrated circuit chip components with different pre-qualified intra-process monitoring circuits and said selecting of said at least one intra-process monitoring circuit comprising:

using said cross-correlation table to identify a sub-set of said pre-qualified intra-process monitoring circuits that have been correlated to a particular component; and

selecting said at least one intra-process monitoring circuit from said sub-set.

14. The method of claim 13, said selecting of said at least one intra-process monitoring circuit from said sub-set comprising selecting said at least one intra-process monitoring circuit based on a desired parameter to be monitored.

15. The method of claim 13, said selecting of said at least one intra-process monitoring circuit from said sub-set comprising selecting said at least one intra-process monitoring circuit based on one of available area on-chip and available area within scribe lines.

16. The method of claim 11, said at least one intra-process monitoring circuit comprising one of an on-chip circuit and a within scribe line circuit.

17. An integrated circuit chip design flow and fabrication method comprising:

analyzing design data, said design data being representative of a design of an integrated circuit chip comprising a plurality of integrated circuit chip components and said analyzing comprising identifying said components;

selecting at least one intra-process monitoring circuit from a library, said library comprising a set of pre-qualified intra-process monitoring circuits;

modifying said design data to incorporate said at least one intra-process monitoring circuit;

generating an extension to a test program to allow for intra-process monitoring of at least one process-dependent parameter of at least one of said components of said integrated circuit chip using said at least one intra-process monitoring circuit during fabrication of a wafer comprising multiple instances of said integrated circuit chip, said process-dependent parameter comprising any one of an electrical parameter and a physical parameter of said at least one of said components; and

modifying routing instructions to incorporate said extension.

18. The method of claim 17, further comprising, during said fabrication, performing said extension of said test program, and based on results of said performing, adjusting at least one process step.

19. The method of claim 17, said design data comprising at least one of an integrated circuit layout and a netlist.

20. The method of claim 17, said library further comprising a cross-correlation table that correlates different integrated circuit chip components with different pre-qualified intra-process monitoring circuits and said selecting of said at least one intra-process monitoring circuit comprising:

using said cross-correlation table to identify a sub-set of said pre-qualified intra-process monitoring circuits that have been correlated to a particular component; and

selecting said at least one intra-process monitoring circuit from said sub-set.