Method of forming lateral trench gate FET with direct source-drain current path
First Claim
1. A method of forming a field effect transistor (FET) comprising:
- forming a drift region comprising a stack of alternating conductivity type silicon layers;
forming a drain region of a first conductivity type extending into the stack of alternating conductivity type silicon layers;
forming a trench gate extending into the stack of alternating conductivity type silicon layers, the trench gate having a vertically extending non-active sidewall and a vertically extending active sidewall being perpendicular to one another; and
forming a body region of a second conductivity type adjacent to the active sidewall of the trench gate, wherein the trench gate and the drain region are formed such that the non-active sidewall of the trench gate faces the drain region and the body region extends along the active sidewall but not the non-active sidewall.
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Abstract
A method of forming a field effect transistor (FET) includes: forming a drift region comprising a stack of alternating conductivity type silicon layers; forming a drain region of a first conductivity type extending into the stack of alternating conductivity type silicon layers; forming a trench gate extending into the stack of alternating conductivity type silicon layers, the trench gate having a non-active sidewall and an active sidewall being perpendicular to one another; and forming a body region of a second conductivity type adjacent to the active sidewall of the trench gate, wherein the trench gate and the drain region are formed such that the non-active sidewall of the trench gate faces the drain region.
27 Citations
15 Claims
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1. A method of forming a field effect transistor (FET) comprising:
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forming a drift region comprising a stack of alternating conductivity type silicon layers; forming a drain region of a first conductivity type extending into the stack of alternating conductivity type silicon layers; forming a trench gate extending into the stack of alternating conductivity type silicon layers, the trench gate having a vertically extending non-active sidewall and a vertically extending active sidewall being perpendicular to one another; and forming a body region of a second conductivity type adjacent to the active sidewall of the trench gate, wherein the trench gate and the drain region are formed such that the non-active sidewall of the trench gate faces the drain region and the body region extends along the active sidewall but not the non-active sidewall. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification