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Configurable inputs and outputs for memory stacking system and method

  • US 8,098,508 B2
  • Filed: 09/14/2009
  • Issued: 01/17/2012
  • Est. Priority Date: 12/30/2005
  • Status: Expired due to Fees
First Claim
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1. A memory device comprising:

  • a die including a top surface and a bottom surface separated by a thickness, the die configured to receive a control signal through a first path disposed through the die from the top surface to the bottom surface in a direction generally parallel to the thickness and through a second path disposed through the die from the top surface to the bottom surface in the direction generally parallel to the thickness;

    a circuit included in the die, the circuit configured to be enabled by the control signal via the first path or the second path; and

    a path selector configured to select the first path or the second path for transmission of the control signal.

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