Field configured electronic circuits and methods of making the same
First Claim
1. A method of field programming an integrated circuit comprising:
- a) inputting logic and/or circuit functions into a computer configured to design and correct one or more field-configurable circuit layouts;
b) designing one or more circuit layouts from the logic and/or circuit functions; and
c) printing one or more metal layers on a transistor array on a substrate, the transistor array having a dielectric layer thereon, according to the one or more circuit layouts.
4 Assignments
0 Petitions
Accused Products
Abstract
Semiconductor devices and/or structures, and methods for fabricating the same are disclosed. Embodiments of the present invention allow for production of customized products, while also minimizing production steps, avoiding some or all photolithography steps, and reducing overall production costs. Using selective deposition and patterning methods such as printing, to form metal and/or dielectric layer(s) on substrates where one or more device circuit components are pre-made in a factory, but which require further processing to obtain an electrically functional circuit, results in the ability for a user/consumer to make custom, specific and/or unique electrically functional circuits without incurring the cost and complexity of a full fabrication to form and pattern all of the layers.
17 Citations
35 Claims
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1. A method of field programming an integrated circuit comprising:
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a) inputting logic and/or circuit functions into a computer configured to design and correct one or more field-configurable circuit layouts; b) designing one or more circuit layouts from the logic and/or circuit functions; and c) printing one or more metal layers on a transistor array on a substrate, the transistor array having a dielectric layer thereon, according to the one or more circuit layouts. - View Dependent Claims (2, 3, 4, 5)
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6. A method of field-configuring a circuit, comprising:
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a) depositing a first metal ink according to a predetermined wiring pattern on or over a substrate having an array of transistors thereon and a first dielectric layer on the transistors, the first dielectric layer having a first plurality of contact openings therein exposing a surface of each terminal of the transistors, wherein the predetermined wiring pattern enables predetermined functionality and/or logic in a circuit comprising the transistors and the predetermined wiring pattern; and b) forming a first plurality of patterned metal lines from the first metal ink. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A device comprising:
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a) a substrate with an array of transistors thereon; b) a first dielectric layer on the substrate having a first plurality of contact openings therein, each contact opening exposing a transistor terminal; c) a first layer of patterned metal wires electrically connected to the terminals of the transistors in the array; d) a second dielectric layer on the first layer of patterned metal wires having a second plurality of contact openings therein, exposing a surface of the first layer of patterned metal wires; and e) a first printed pattern of metal lines thereon or thereover. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35)
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Specification