Method of teaching eyepoints for wire bonding and related semiconductor processing operations

• US 8,100,317 B2
• Filed: 03/28/2011
• Issued: 01/24/2012
• Est. Priority Date: 03/13/2007
• Status: Active Grant

• Current Assignee: Kulicke and Soffa Industries Incorporated
• Original Assignee: Kulicke and Soffa Industries Incorporated
• Inventors: Deley, Michael T., Lister, Peter M., Sood, Deepak, Wang, Zhijie
• Primary Examiner(s): Ward, Jessica L
• Assistant Examiner(s): Patel, Devang R
• Application Number:
  US13/072,930
• Publication Number:
  US 20110174865A1
• Time in Patent Office: 302 Days
• Field of Search: 228/4.5, 228/180.5, 228/904, 219/56.1, 219/85.18
• US Class Current: 228/180.5
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: H01L 2223/5442 comprising non digital, non alphanumeric information, e.g. symbols
• CPC Class Codes: H01L 2223/54426 for alignment
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2223/5448 Located on chip prior to dicing and remaining on chip after dicing
• CPC Class Codes: H01L 2224/02166 Collar structures
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05556 in side view
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/78901 using a computer, e.g. fully- or semi-automatic bonding
• CPC Class Codes: H01L 2224/85121 : Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 23/544 : Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/78 : Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: Y10S 228/904 : Wire bonding

Abstract

A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Claims

1. A method of teaching an eyepoint for a wire bonding operation, the method comprising the steps of:

(1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, the group of shapes including at least one of (a) bond pad shapes, (b) fiducial shapes, and (c) circuitry shapes;

(2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device, the teaching step including defining locations of each of the shapes with respect to one another to bind the selected shapes together as the eyepoint;

(3) scanning a region of another semiconductor device using a vision system of a wire bonding machine to locate a feature of the another semiconductor device corresponding to the taught eyepoint; and

(4) assigning a score to the another semiconductor device by comparing the taught eyepoint to the feature located at the scanned region.

2. The method of claim 1 wherein step (1) includes selecting the group of shapes to include a plurality of bond pad shapes.

3. The method of claim 1 wherein step (1) includes selecting the group of shapes to include a plurality of bond pad shapes and at least one fiducial shape.

4. The method of claim 1 further comprising the step of (3) defining the eyepoint to include the group of shapes while masking predetermined areas of the region such that the predetermined areas are precluded from the eyepoint.

5. The method of claim 4 wherein the step of masking includes masking at least one of (1) interior portions of selected bond pads, and (2) portions of the region between bond pads.

6. The method of claim 1 wherein step (2) includes defining the locations to include an area surrounding each of the group of shapes.

7. The method of claim 1 further comprising the step of (3) teaching a second eyepoint to the wire bonding machine, the second eyepoint corresponding to a shape of a portion of a wire loop on a bond pad of the semiconductor device.

8. The method of claim 7 wherein the shape corresponds to the shape of a ball bond of the wire loop.

9. The method of claim 1 wherein the eyepoint taught by the method is configured to be a back-up eyepoint of the wire bonding operation.

10. A method of operating a wire bonding machine, the method comprising the steps of:

(1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, the group of shapes including at least one of (a) bond pad shapes, (b) fiducial shapes, and (c) circuitry shapes;

(2) teaching the eyepoint to the wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device, the teaching step including defining locations of each of the shapes with respect to one another to bind the selected shapes together as the evepoint;

(3) indexing another semiconductor device configured to be wire bonded into a predetermined position of the wire bonding machine;

(4) scanning selected portions of the first another semiconductor device using a vision system of the wire bonding machine to locate a feature of the another semiconductor device corresponding to the taught eyepoint; and

(5) assigning a score to the another semiconductor device by comparing the taught evepoint to the scanned feature.

11. The method of claim 10 wherein step (1) includes selecting the group of shapes to include a plurality of bond pad shapes.

12. The method of claim 10 wherein step (1) includes selecting the group of shapes to include a plurality of bond pad shapes and at least one fiducial shape.

13. The method of claim 10 further comprising the step of (3) defining the eyepoint to include the group of shapes while masking predetermined areas of the region such that the predetermined areas are precluded from the eyepoint.

14. The method of claim 13 wherein the step of masking includes masking at least one of (1) interior portions of selected bond pads, and (2) portions of the region between bond pads.

15. The method of claim 10 wherein step (2) includes defining the locations to include an area surrounding each of the group of shapes.

16. The method of claim 10 further comprising the step of (5) teaching a second eyepoint to the wire bonding machine, the second eyepoint corresponding to a shape of a portion of a wire loop on a bond pad of the semiconductor device.

17. The method of claim 16 wherein the shape corresponds to the shape of a ball bond of the wire loop.

18. The method of claim 10 wherein the eyepoint taught at step (2) is configured to be a back-up eyepoint of the wire bonding operation.

19. The method of claim 10 further comprising the step of adjusting a position of the another semiconductor device at least partially based on a result of comparing the taught eyepoint to the scanned feature.

20. The method of claim 10 further comprising the step of creating wire loops between bond pads of the another semiconductor and another bonding location.