Light-emitting devices and related systems

• US 8,100,567 B2
• Filed: 12/30/2005
• Issued: 01/24/2012
• Est. Priority Date: 10/19/2005
• Status: Expired due to Fees

• Current Assignee: Rambus Delaware LLC (Rambus Inc.)
• Original Assignee: Rambus International Ltd (Rambus Inc.)
• Inventors: Erchak, Alexei A., Lim, Michael, Lidorikis, Elefterios, Venezia, Jo A., Nemchuk, Nikolay I., Karlicek, Robert F. Jr.
• Primary Examiner(s): Ward, John A
• Application Number:
  US11/323,176
• Publication Number:
  US 20070085082A1
• Time in Patent Office: 2,216 Days
• Field of Search: 362/580, 362/547, 362/218, 362/264, 362/267, 362/345, 362/373, 362/600, 362/609, 362/611, 362/612, 362/613, 362/614, 362/632, 362/634, 349/58, 349/65, 349/67, 349/70, 257/81.99, 257/E33.075, 257/98, 257/712, 257/715, 361/700, 165/80.4, 165/104.26, 174/15.2
• US Class Current: 362/373
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

Light-emitting devices can include a package that supports one or more light-emitting die (e.g., light-emitting diode die, laser diode die) and which can ensure mechanically stability, can facilitate electrical and/or thermal coupling with light-emitting die, and can manipulate the manner by which light generated by the die is emitted out of the light-emitting device. The package can also facilitate the integration of the light-emitting devices in various components and systems. For example, suitable packages may facilitate the use of light-emitting devices in components and systems such as light-emitting panel assemblies, LCD back lighting, general lighting, decorative or display lighting, automotive lighting, and other types of lighting components and systems.

Claims

1. A light-emitting panel assembly comprising:

a light-emitting diode having a side from which light is emitted;

a heat pipe in contact with the light-emitting diode including a fluid contained therein, the fluid extracting heat from the light-emitting diode by thermal convection as a result of flow of the fluid through the heat pipe; and

an illumination panel having a side edge adjacent the side of the light-emitting diode from which light is emitted such that light is emitted into the illumination panel via the side edge, the illumination panel propagating the light therein and further including scattering centers that direct the light out of an emission surface of the illumination panel,

wherein the heat pipe extends beneath the emission surface in a direction across the emission surface.

2. The light-emitting panel assembly of claim 1, wherein the heat pipe is arranged to wrap around a backside of the illumination panel.

3. The light-emitting panel assembly of claim 1, wherein the heat pipe is arranged to wrap around at least a portion of an edge of the illumination panel.

4. The light-emitting panel assembly of claim 1, further comprising a second heat pipe in contact with the light-emitting diode and designed to extract heat from the light-emitting device.

5. The light-emitting panel assembly of claim 4, wherein the light-emitting diode comprises a plurality of light-emitting die, wherein the second heat pipe is designed to extract heat in the vicinity of one of the plurality of the light-emitting die.

6. The light-emitting panel assembly of claim 1, wherein the heat pipe extends substantially across the illumination panel.

7. The light-emitting panel assembly of claim 1, further comprising a light-emitting module assembly comprising the light-emitting diode having a first feature and a second light-emitting device having a second feature, wherein the first feature and the second feature are engaged to connect the first light-emitting device and the second light-emitting device.

8. A light-emitting panel assembly comprising:

a light-emitting diode having a side from which light is emitted;

an illumination panel having a side edge adjacent the side of the light-emitting diode from which light is emitted such that light is emitted into the illumination panel via the side edge, the illumination panel propagating the light therein and further including scattering centers that direct the light out of an emission surface of the illumination panel; and

a supporting structure constructed and arranged to support the light-emitting diode and the illumination panel, wherein the supporting structure conducts heat generated by the light-emitting diode, and the supporting structure extends beneath the emission surface and substantially across the illumination panel.

9. The light-emitting panel assembly of claim 8, further comprising an LCD layer disposed over the illumination panel.

10. The light-emitting panel assembly of claim 8, wherein the supporting structure and the illumination panel are not in thermal contact.

11. The light-emitting panel assembly of claim 10, wherein a thermally insulating layer is disposed between the supporting structure and the illumination panel such that the supporting structure and the illumination panel are not in thermal contact.

12. The light-emitting panel assembly of claim 8, further comprising an external heat sink constructed and arranged to extract heat from the light-emitting diode.

13. The light-emitting panel assembly of claim 8, wherein at least a portion of the supporting section is substantially parallel to the illumination panel.

14. The light-emitting panel assembly of claim 8, wherein the supporting structure includes a heat pipe associated therewith that extends beneath the emission surface and substantially across the illumination panel.