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LEDs using single crystalline phosphor and methods of fabricating same

  • US 8,101,443 B2
  • Filed: 12/07/2010
  • Issued: 01/24/2012
  • Est. Priority Date: 04/10/2008
  • Status: Active Grant
First Claim
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1. A method for fabricating light emitting diode (LED) chips from a wafer, comprising:

  • depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on said growth wafer; and

    bonding a single crystalline phosphor over at least some said plurality of LEDs so that at least some light from the covered ones of said LEDs passes through said single crystalline phosphor and is converted.

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