Light-emitting diode lamp with low thermal resistance
First Claim
1. A light-emitting diode structure comprising:
- a light-emitting diode semiconductor active layer deposited on a metal substrate enclosed in a casing;
a secondary metal plate electrically connected to a bond pad on the active layer;
a primary metal plate electrically and thermally conductively connected to the metal substrate via a first metal bonding layer, wherein the primary and secondary metal plates are positioned at an interior bottom surface of the casing and extend laterally through the casing to provide external electrical connections for the light-emitting diode structure;
an upper thermal conductivity layer situated below a bottom surface of the casing;
a second metal bonding layer situated between the upper thermal conductivity layer and a lower thermal conductivity layer; and
a dielectric layer for heat conduction sandwiched between the lower thermal conductivity layer and a heat sink, wherein the heat sink is exposed at a bottom of the light-emitting diode structure.
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Abstract
A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable light-emitting diode structure is provided having an active layer deposited on a metal substrate directly bonded to a metal plate that is substantially exposed for low thermal resistance by positioning it on the bottom of the light-emitting diode structure. This metal plate can then be soldered to a printed circuit board (PCB) that includes a heat sink. For some embodiments of the invention, the metal plate is thermally and electrically conductively connected through several heat conduction layers to a large heat sink that may be included in the structure.
84 Citations
8 Claims
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1. A light-emitting diode structure comprising:
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a light-emitting diode semiconductor active layer deposited on a metal substrate enclosed in a casing; a secondary metal plate electrically connected to a bond pad on the active layer; a primary metal plate electrically and thermally conductively connected to the metal substrate via a first metal bonding layer, wherein the primary and secondary metal plates are positioned at an interior bottom surface of the casing and extend laterally through the casing to provide external electrical connections for the light-emitting diode structure; an upper thermal conductivity layer situated below a bottom surface of the casing; a second metal bonding layer situated between the upper thermal conductivity layer and a lower thermal conductivity layer; and a dielectric layer for heat conduction sandwiched between the lower thermal conductivity layer and a heat sink, wherein the heat sink is exposed at a bottom of the light-emitting diode structure. - View Dependent Claims (2, 3, 4, 5)
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6. A light-emitting diode structure comprising:
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a light-emitting diode semiconductor active layer deposited on a metal substrate enclosed in a casing; a secondary metal plate electrically connected to a bond pad on the active layer; a primary metal plate electrically and thermally conductively connected to the metal substrate via a first metal bonding layer, wherein the primary and secondary metal plates are positioned at an interior bottom surface of the casing and extend laterally beyond an upper portion of the casing to provide external electrical connections for the light-emitting diode structure; and an upper thermal conductivity layer situated below a bottom surface of the casing. - View Dependent Claims (7, 8)
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Specification