Wafer level buck converter

• US 8,102,029 B2
• Filed: 10/31/2008
• Issued: 01/24/2012
• Est. Priority Date: 10/31/2008
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Fairchild Semiconductor Corporation (ON Semiconductor Corporation)
• Inventors: Liu, Yong, Wang, Qi
• Primary Examiner(s): Smith, Bradley K
• Assistant Examiner(s): Payen, Marvin
• Application Number:
  US12/262,570
• Publication Number:
  US 20100109129A1
• Time in Patent Office: 1,180 Days
• Field of Search: 257/621, 257/E21.511, 257/E23.079
• US Class Current: 257/621
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2224/29075 Plural core members
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 25/074 Stacked arrangements of non-apertured devices
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H02M 3/155 using semiconductor devices only

Abstract

A buck converter module includes a high side (HS) die having source, drain, and gate bonding pads on a front side of the HS die, a low side (LS) die having a first section thereof with a plurality of through silicon vias (TSVs) extending from a back side to a front side of the LS die, the LS die having source, drain, and gate bonding pads located on a front side of a second section separate from the first section, the drain bonding pad electrically connected to the back side of the LS die in the second section. The HS die and the LS die are bonded together such that the source bonding pad of the HS die is electrically connected to the back side of the LS die, and each of the drain and gate bonding pads are electrically connected to separate TSVs in the LS die.

Claims

1. A buck converter module comprising:

a) a high side (HS) die having source, drain, and gate bonding pads on a front side of said HS die;

b) a low side (LS) die having a first section thereof with a plurality of through silicon vias (TSVs) extending from a back side to a front side of said LS die, said LS die having source, drain, and gate bonding pads located on a front side of a second section separate from said first section, said drain bonding pad electrically connected to said back side of said LS die in said second section; and

c) said HS die and said LS die bonded together such that said source bonding pad of said HS die is electrically connected to said back side of said LS die, and each of said drain and gate bonding pads are electrically connected to separate TSVs in said LS die.

2. The buck converter module of claim 1 further including solder bumps on said bonding pads of said LS die and on said TSVs on said front side of said LS die.

3. The buck converter module of claim 1 further including an anisotropic conductive film that connects and bonds together said LS die and said HS die.

4. The buck converter module of claim 1 further including metal plates attached to said source, drain, and gate bonding pads of said HS die.

5. The buck converter module of claim 4 wherein said metal plates comprise one of copper studs and gold bumps.

6. The buck converter module of claim 1 wherein said TSVs on the front side of the LS die have a larger surface area than said TSVs on the back side of the LS die.

7. The buck converter module of claim 1 wherein sides of said TSVs are insulated from the rest of said LS die.

8. The buck converter module of claim 1 further including electrically insulating material on the surface of said front side and said back side of said LS die between said TSVs.

9. The buck converter module of claim 8 wherein said insulating material layers in said first and second regions extend to three sides of said LS die in said first section.

10. A buck converter module comprising:

a) a high side (HS) die having source, drain, and gate bonding pads on a front side of said HS die with metal plates attached to each of said bonding pads;

b) a low side (LS) die having a first section thereof with a plurality of through silicon vias (TSVs) extending from a back side to a front side of said LS die, said LS die having source, drain, and gate bonding pads located on a front side of a second section separate from said first section, said drain bonding pad electrically connected to said back side of said LS die in said first section, wherein sides of the TSVs are in contact with an insulator that extends between said TSVs and to three sides of said LS die on said front side and said back side of said LS die;

c) said HS die and said LS die bonded together by an anisotropic conductive film such that said source bonding pad of said HS die is electrically connected to said back side of said LS die, and each of said drain and gate bonding pads are electrically connected to separate TSVs in said LS die; and

d) a plurality of solder bumps attached to said bonding pads of said LS die and on said TSVs on said front side of said LS die.

11. The buck converter module of claim 10 further including metal plates attached to said source, drain, and gate bonding pads.

12. The buck converter module of claim 11 wherein said metal plates comprise one of copper studs and gold bumps.