Semiconductor device and manufacturing method thereof
First Claim
1. A semiconductor device comprising:
- a semiconductor substrate comprising an electronic component formed on a top surface of the semiconductor substrate;
a supporting member having a bottom surface and a top surface and bonded to the semiconductor substrate;
an adhesive layer attaching the bottom surface of the supporting member to the top surface of the semiconductor substrate; and
an electrode disposed on the bottom surface of the supporting member and electrically connected with the electronic component,wherein the supporting member comprises a depressed portion formed from the top surface of the supporting member.
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Accused Products
Abstract
This invention is directed to offer a package type semiconductor device that can realize a smaller size device and its manufacturing method as well as a small stacked layer type semiconductor device and its manufacturing method. A device component 1 and a pad electrode 4 electrically connected with the device component 1 are formed on a semiconductor substrate 2. A supporting member 7 is bonded to a surface of the semiconductor substrate 2 through an adhesive layer 6. There is formed a through-hole 15 in the supporting member 7 penetrating from its top surface to a back surface. Electrical connection with another device is made possible through the through-hole 15. A depressed portion 12 is formed in a partial region of the top surface of the supporting member 7. Therefore, all or a portion of another device or a component can be disposed utilizing a space in the depressed portion 12. When a stacked layer type semiconductor device is formed, stacking is made by fitting a portion of a semiconductor device 50 in an upper layer to an inside of the depressed portion 12.
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Citations
8 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate comprising an electronic component formed on a top surface of the semiconductor substrate; a supporting member having a bottom surface and a top surface and bonded to the semiconductor substrate; an adhesive layer attaching the bottom surface of the supporting member to the top surface of the semiconductor substrate; and an electrode disposed on the bottom surface of the supporting member and electrically connected with the electronic component, wherein the supporting member comprises a depressed portion formed from the top surface of the supporting member. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device comprising:
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a semiconductor substrate comprising an electronic component formed on a top surface of the semiconductor substrate; a supporting member having a bottom surface and a top surface and bonded to the semiconductor substrate; an adhesive layer attaching the bottom surface of the supporting member to the top surface of the semiconductor substrate; and an electrode disposed on the bottom surface of the supporting member and electrically connected with the electronic component; wherein the supporting member has a first through-hole connecting the top and bottom surfaces of the supporting member and provided therein with a first conductive terminal electrically connected with the electrode and a second through-hole not provided with the first conductive terminal and configured to house all or a portion of another device. - View Dependent Claims (8)
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Specification