Load driving device

• US 8,102,047 B2
• Filed: 05/27/2010
• Issued: 01/24/2012
• Est. Priority Date: 06/05/2006
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Shiraki, Satoshi, Yamada, Akira, Ban, Hiroyuki
• Primary Examiner(s): Parekh, Nitin
• Application Number:
  US12/801,187
• Publication Number:
  US 20100238632A1
• Time in Patent Office: 607 Days
• Field of Search: 257/713, 257/707, 257/666, 257/723, 257/E23.051
• US Class Current: 257/713
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/1301 Thyristor
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/1432 : specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 : specially adapted for the configuration of power bus bars

Abstract

A load driving device includes: an output power device for driving a load; a driving IC for controlling the output power device, wherein the driving IC is electrically coupled with the output power device through a wire or a connection member; and a first electrode substrate. The output power device and the driving IC are mounted on the first electrode substrate. In this case, the output power device is controlled with high speed, and a mounting area of the output power device and the driving IC is reduced.

Claims

1. A load driving device comprising:

a power device for driving a load;

a control element for controlling the power device, wherein the control element is electrically coupled with the power device through a wire therebetween;

a spacer element;

first and second heat radiation plates; and

a resin mold, wherein

the power device is sandwiched between the first and second heat radiation plates,

the spacer element is disposed between the power device and the second heat radiation plate so that the wire does not contact the first and second heat radiation plates,

the control element is sandwiched between the first and second heat radiation plates,

the second heat radiation plate includes an opening,

the control element faces the opening of the second heat radiation plate, and

the resin mold partially molds the first and second heat radiation plates, the power device, the spacer element, the wire and the control element.