Method for attaching a semiconductor die to a leadframe, and a semiconductor device

• US 8,105,880 B2
• Filed: 12/05/2007
• Issued: 01/31/2012
• Est. Priority Date: 12/05/2007
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Griffin, Garrett
• Primary Examiner(s): Smoot, Stephen W
• Application Number:
  US11/999,303
• Publication Number:
  US 20090146279A1
• Time in Patent Office: 1,518 Days
• Field of Search: 438/617
• US Class Current: 438/118
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/29012 in top view
• CPC Class Codes: H01L 2224/29082 Two-layer arrangements
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/75611 Feeding means
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83194 Lateral distribution of the layer connectors
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/83856 : Pre-cured adhesive, i.e. B-stage adhesive
• CPC Class Codes: H01L 2224/85 : using a wire connector
• CPC Class Codes: H01L 23/293 : Organic, e.g. plastic
• CPC Class Codes: H01L 23/4951 : Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 23/49513 : having bonding material between chip and die pad
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10161 : with a rectangular active surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

Methods are disclosed related to attaching a die to a leadframe. One such method includes initially bonding a carrier pad which is pre-coated with a thermosetting first adhesive to the leadframe. The first adhesive can be raised to its thermosetting cure temperature by heating the leadframe to a temperature just above the thermosetting cure temperature of the first adhesive. A thermosetting second adhesive which is liquid at room temperature can be applied to a second major surface of the carrier pad, and the die can be placed on the second adhesive and aligned with the leadframe. The second adhesive can be raised to its thermosetting cure temperature to bond the die to the carrier pad, and in turn form a bonded assembly.

Claims

1. A method for attaching a semiconductor die to a leadframe, the method comprising:

providing the leadframe with a carrier pad attached thereto, the carrier pad being electrically non-conductive and having first and second major surfaces, and an at least a partially cured first adhesive bonding the leadframe to the first major surface of the carrier pad,

applying, after providing the leadframe with the carrier pad attached thereto, a flowable temperature curable second adhesive to the second major surface of the carrier pad, in which the second adhesive is liquid at room temperature,

placing the die on the second adhesive on the second major surface of the carrier pad for facilitating wire bonding of the die to the leadframe, and

subjecting the second adhesive to a curing temperature for curing thereof to bond the die to the carrier pad.

2. A method as claimed in claim 1 in which the second adhesive is applied to the second major surface of the carrier pad by dispensing the second adhesive through a nozzle.

3. A method as claimed in claim 2 in which the second adhesive is dispensed through the nozzle so that the second adhesive forms a pattern on the second major surface of the carrier pad, and the nozzle is moved during dispensing of the second adhesive therefrom in a common plane of movement in at least one of an X-axis direction and a Y-axis direction for applying the second adhesive on the second major surface of the carrier pad in the form of the pattern.

4. A method as claimed in claim 3 in which the second adhesive is continuously dispensed through the nozzle while the nozzle is being moved in the at least one of the X- and Y-axes directions to form the pattern of the second adhesive as a continuous pattern on the second major surface of the carrier pad.

5. A method as claimed in claim 3 in which dispensing of the second adhesive through the nozzle is periodically disrupted while the nozzle is being moved in the at least one of the X- and Y-axes directions to form the pattern of the second adhesive as a discontinuous pattern comprising a plurality of discrete portions of the adhesive.

6. A method as claimed in claim 3 in which the common plane of movement of the nozzle in the X- and Y-axes directions lies substantially parallel to a plane defined by the second major surface of the carrier pad.

7. A method as claimed in claim 1 in which the die is pressed into engagement with the second adhesive on the second major surface of the carrier pad, and is maneuvered thereon for aligning electrically conductive contact pads of the die with corresponding leads of the leadframe for facilitating subsequent wire bonding of contact pads of the die and the leads of the leadframe.

8. A method as claimed in claim 1 in which the second adhesive is a thermosetting electrically non-conductive adhesive.

9. A method as claimed in claim 8 in which the first adhesive is an electrically non-conducting thermosetting adhesive.

10. A method as claimed in claim 1 in which the second adhesive has a cure temperature in the range of 80°

C. to 250°

C.

11. A method as claimed in claim 10 in which the second adhesive has a cure temperature of approximately 175°

C.

12. A method as claimed in claim 1 in which the first adhesive bonds the leadframe to the first major surface of the carrier pad with the carrier pad overlaying proximal portions of proximal ends of leads of the leadframe.

13. A method as claimed in claim 1 in which the carrier pad is of a flexible material.

14. A method as claimed in claim 1 in which the carrier pad is of polyimide material stable at the cure temperature of the second adhesive.

15. A method as claimed in claim 1 in which the area of the carrier pad in plan view is substantially similar to the area of the die in plan view.

16. A method as claimed in claim 1 in which the die and the carrier pad are attached to the leadframe so that the die overlays proximal ends of at least some of the leads of the leadframe.

17. A method as claimed in claim 1 in which the die comprises a first major surface adjacent which an integrated circuit is formed therein, and a second major surface remote from the integrated circuit and defined by a substrate on which the integrated circuit is formed, and the die is placed on the second adhesive with one of the first and second major surfaces of the die abutting the second adhesive.

18. A method as claimed in claim 1 in which the method further comprises wire bonding the die to the leadframe, and encapsulating the die, the leadframe and the carrier pad bonded together in an encapsulating housing of a mouldable thermosetting material, with distal ends of leads of the leadframe extending from the encapsulating housing.

19. A method as claimed in claim 1 in which the first adhesive is a temperature curable adhesive.

20. A method as claimed in claim 1 in which the first adhesive has a cure temperature in the range of 120°

C. to 250°

C.

21. A method as claimed in claim 20 in which the first adhesive has a cure temperature of approximately 200°

C.

22. A method as claimed in claim 1 in which the first adhesive is pre-coated onto the first major surface of the carrier pad, and is partially cured thereon prior to applying the flowable temperature curable second adhesive.

23. A method as claimed in claim 1 further comprising bonding the carrier pad to the leadframe prior to bonding the die to the carrier pad.

24. A method as claimed in claim 23 in which the carrier pad is placed on the leadframe with the first adhesive on the first major surface thereof abutting the leadframe, and the leadframe is heated for in turn at least partially curing the first adhesive prior to bonding the die to the carrier pad.

25. The method of claim 1 in which the first adhesive is not liquid at room temperature.

26. The method of claim 1 in which the first adhesive has a higher cure temperature than the second adhesive.

27. A method for attaching a semiconductor die to a leadframe, the method comprising:

providing the leadframe with a flexible carrier pad attached thereto, the flexible carrier pad being electrically non-conductive and having first and second major surfaces, the first major surface being bonded to the leadframe via a first adhesive, wherein the flexible carrier pad overlays proximal portions of proximal ends of leads of the leadframe,

applying, after providing the leadframe with the flexible carrier pad attached thereto, a flowable second adhesive to the second major surface of the flexible carrier pad, wherein the second adhesive is liquid at room temperature,

positioning the die over the second adhesive on the second major surface of the flexible carrier pad, and

curing the second adhesive so as to secure the die to the flexible carrier pad.