Through-wafer interconnection
First Claim
1. A method for fabricating through-wafer interconnects in a microelectronic structure, the method comprising:
- providing a conductive wafer having a front side and a backside; and
forming a patterned trench in the conductive wafer by removing material of the conductive wafer, wherein the patterned trench has an annular circumferential opening dividing the conductive wafer along the opening into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor, and wherein the patterned trench comprises a first trench portion having a first cross-sectional size and a second trench portion having a second cross-sectional size different from the first cross-sectional size.
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Accused Products
Abstract
A through-wafer interconnect and a method for fabricating the same are disclosed. The method starts with a conductive wafer to form a patterned trench by removing material of the conductive wafer. The patterned trench extends in depth from the front side to the backside of the wafer, and has an annular opening generally dividing the conductive wafer into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor. A dielectric material is formed or added into the patterned trench mechanical to support and electrically insulate the through-wafer conductor. Multiple conductors can be formed in an array.
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Citations
64 Claims
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1. A method for fabricating through-wafer interconnects in a microelectronic structure, the method comprising:
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providing a conductive wafer having a front side and a backside; and forming a patterned trench in the conductive wafer by removing material of the conductive wafer, wherein the patterned trench has an annular circumferential opening dividing the conductive wafer along the opening into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor, and wherein the patterned trench comprises a first trench portion having a first cross-sectional size and a second trench portion having a second cross-sectional size different from the first cross-sectional size. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A method for fabricating through-wafer interconnects in a microelectronic structure, the method comprising:
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providing a conductive wafer having a front side and a backside; forming a first portion of a patterned trench from one of the front side or the backside in the conductive wafer by removing material of the conductive wafer, the patterned trench having an annular circumferential opening dividing the conductive wafer along the opening into an inner portion and an outer portion so that the inner portion of the conductive wafer is located within the annular circumferential opening and insulated from the outer portion to form a through-wafer conductor, the first portion of the patterned trench being formed having a first pattern; providing a stop material on a bottom of the first portion to define a stop position; and forming a second portion of the patterned trench from the other of the front side and the backside, the forming the second portion of the patterned trench ceasing when the second portion of the patterned trench reaches the stop position, the second portion of the patterned trench being formed having a second pattern different from the first pattern of the first portion of the patterned trench. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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30. The method of 29 wherein the intervening material is an oxide layer formed on the one of the top layer or the bottom layer of the conductive wafer.
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43. A method for fabricating through-wafer interconnects in a microelectronic structure, the method comprising:
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providing a conductive wafer having a front side and a backside; forming a first portion of a patterned trench from one of the front side or the backside in the conductive wafer by removing material of the conductive wafer, the patterned trench having an annular circumferential opening dividing the conductive wafer along the opening into an inner portion and an outer portion so that the inner portion of the conductive wafer is insulated from the outer portion to form a through-wafer conductor, the first trench portion having a first cross-sectional size; providing a stop material on a bottom of the first portion to define a stop position; and forming a second portion of the patterned trench from the other of the front side and the backside, the forming the second portion of the patterned trench stopping when the second portion of the patterned trench reaches the stop position, the second trench portion having a second cross-sectional size different from the first cross-sectional size of the first portion of the patterned trench. - View Dependent Claims (44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63)
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64. A method for fabricating through-wafer interconnects in a microelectronic structure, the method comprising:
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providing a conductive wafer having a front side and a backside; forming a patterned trench in the conductive wafer by removing material of the conductive wafer from at least one of the front side or the backside, wherein the patterned trench has an annular circumferential opening dividing the conductive wafer along the opening into an inner portion and an outer portion, such that the inner portion of the conductive wafer is located within the annular circumferential opening and insulated from the outer portion to serve as a through-wafer conductor; and adding a filler material into the patterned trench to maintain the through-wafer conductor within the annular circumferential opening during at least one subsequent fabricating step.
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Specification