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Through-wafer interconnection

  • US 8,105,941 B2
  • Filed: 05/18/2006
  • Issued: 01/31/2012
  • Est. Priority Date: 05/18/2005
  • Status: Active Grant
First Claim
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1. A method for fabricating through-wafer interconnects in a microelectronic structure, the method comprising:

  • providing a conductive wafer having a front side and a backside; and

    forming a patterned trench in the conductive wafer by removing material of the conductive wafer, wherein the patterned trench has an annular circumferential opening dividing the conductive wafer along the opening into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor, and wherein the patterned trench comprises a first trench portion having a first cross-sectional size and a second trench portion having a second cross-sectional size different from the first cross-sectional size.

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