Triple-axis MEMS accelerometer having a bottom capacitor
First Claim
1. An integrated circuit structure comprising:
- a substrate having a top surface;
a proof-mass over the substrate and comprising a first conductive layer at a bottom of the proof-mass;
springs connected to the proof-mass, wherein the springs comprise;
horizontal upper portions substantially parallel to the top surface;
horizontal lower portions substantially parallel to the top surface, wherein the horizontal upper portions and the horizontal lower portions are vertically mis-aligned; and
connecting portions connected between the horizontal upper portions and the horizontal lower portions;
a second conductive layer spaced apart from the first conductive layer by an air space, wherein the first conductive layer and the second conductive layer are parallel to each other to form a capacitor;
a first contact pad and a second contact pad coupled to the first conductive layer and the second conductive layer, respectively.
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Accused Products
Abstract
An integrated circuit structure includes a substrate having a top surface; a first conductive layer over and contacting the top surface of the substrate; a dielectric layer over and contacting the first conductive layer, wherein the dielectric layer includes an opening exposing a portion of the first conductive layer; and a proof-mass in the opening and including a second conductive layer at a bottom of the proof-mass. The second conductive layer is spaced apart from the portion of the first conductive layer by an air space. Springs anchor the proof-mass to portions of the dielectric layer encircling the opening. The springs are configured to allow the proof-mass to make three-dimensional movements.
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Citations
20 Claims
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1. An integrated circuit structure comprising:
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a substrate having a top surface; a proof-mass over the substrate and comprising a first conductive layer at a bottom of the proof-mass; springs connected to the proof-mass, wherein the springs comprise; horizontal upper portions substantially parallel to the top surface; horizontal lower portions substantially parallel to the top surface, wherein the horizontal upper portions and the horizontal lower portions are vertically mis-aligned; and connecting portions connected between the horizontal upper portions and the horizontal lower portions; a second conductive layer spaced apart from the first conductive layer by an air space, wherein the first conductive layer and the second conductive layer are parallel to each other to form a capacitor; a first contact pad and a second contact pad coupled to the first conductive layer and the second conductive layer, respectively. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An integrated circuit structure comprising:
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a substrate having a top surface; and a triple-axis accelerometer comprising; a first conductive layer over and contacting the top surface of the substrate, wherein the first conductive layer forms a first capacitor plate of a first capacitor; a proof-mass comprising; a central block formed of a first material; and a second conductive layer formed of a second material different from the first material, wherein the second conductive layer encloses the central block, and wherein a bottom portion of the second conductive layer forms a second capacitor plate of the first capacitor; and an air space over the first capacitor plate and between the first capacitor plate and the second capacitor plate. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. An integrated circuit structure comprising:
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a substrate having a top surface; a first conductive layer over and contacting the top surface of the substrate; a dielectric layer over and contacting the first conductive layer, wherein the dielectric layer comprises an opening exposing a portion of the first conductive layer; a proof-mass in the opening and comprising a second conductive layer at a bottom of the proof-mass, wherein the second conductive layer is spaced apart from the portion of the first conductive layer by an air space; and springs anchoring the proof-mass to portions of the dielectric layer encircling the opening, wherein the springs are configured to allow the proof-mass to make three-dimensional movements. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification