Wafer level packaging
First Claim
1. A die comprising:
- an active area on a substrate;
an insulator on the active area;
first and second bond pads on the insulator and electrically connected to the active area;
a first contact;
a second contact;
a first trace connecting the first bond pad to the first contact, at least a portion of the first trace being placed on top of the insulator over a portion of the active area; and
a second trace connecting the second bond pad to the second contact, the second trace being nonparallel to the first trace.
7 Assignments
0 Petitions
Accused Products
Abstract
Through vias in a substrate are formed by creating a trench in a top side of the substrate and at least one trench in the back side of the substrate. The sum of the depths of the trenches at least equals the height of the substrate. The trenches cross at intersections, which accordingly form the through vias from the top side to the back side. The through vias are filled with a conductor to form contacts on both sides and the edge of the substrate. Contacts on the backside are formed at each of the trench. The through vias from the edge contacts. Traces connect bond pads to the conductor in the through via. Some traces are parallel to the back side traces. Some traces are skew to the back side traces. The substrate is diced to form individual die.
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Citations
18 Claims
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1. A die comprising:
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an active area on a substrate; an insulator on the active area; first and second bond pads on the insulator and electrically connected to the active area; a first contact; a second contact; a first trace connecting the first bond pad to the first contact, at least a portion of the first trace being placed on top of the insulator over a portion of the active area; and a second trace connecting the second bond pad to the second contact, the second trace being nonparallel to the first trace. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A die comprising:
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an active area on a substrate having a first edge and a second edge opposite the first edge; a first recess in the first edge; a first contact in the first recess; a second recess in the second edge; a second contact in the second recess; a first bond pad on the substrate and electrically connected to the active area; a second bond pad on the substrate and electrically connected to the active area; a first trace connecting the first bond pad to the first contact; and a second trace connecting the second bond pad to the second contact, wherein the first recess extends from a first side of the substrate to a second side of the substrate opposing the first side, so that electrical connection to the active area can be made from either the first side or the second side. - View Dependent Claims (11)
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12. A die comprising:
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a first side of a substrate; a plurality of bond pads on the first side of the substrate; a plurality of pairs of contacts on the substrate, wherein a first contact of the pairs is substantially linearly aligned on a plane of the first side of the substrate in a first direction with a second contact of the pair and a first bond pad of the plurality of bond pads; a first trace connecting the first contact to the first bond pad; and a second trace connecting a second bond pad of the plurality of bond pads to the second contact. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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Specification