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Wafer level packaging

  • US 8,106,488 B2
  • Filed: 10/06/2010
  • Issued: 01/31/2012
  • Est. Priority Date: 06/14/2002
  • Status: Active Grant
First Claim
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1. A die comprising:

  • an active area on a substrate;

    an insulator on the active area;

    first and second bond pads on the insulator and electrically connected to the active area;

    a first contact;

    a second contact;

    a first trace connecting the first bond pad to the first contact, at least a portion of the first trace being placed on top of the insulator over a portion of the active area; and

    a second trace connecting the second bond pad to the second contact, the second trace being nonparallel to the first trace.

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