Simplified micro-bridging and roughness analysis
First Claim
Patent Images
1. A method for processing a substrate using statistical variance data comprising:
- using a computer to perform the following;
establishing a first defect type for analysis on a first patterned substrate selected from a group of patterned substrates, wherein the first defect type includes a micro-bridging defect, or a line edge roughness (LER) defect, or a line width roughness (LWR) defect;
obtaining defect analysis data from a plurality of analysis segments on the first patterned substrate, wherein the defect analysis data includes bright-field data, dark-field data, NLS data, intensity data, intensity difference data, contrast data, or hot-spot data, or any combination thereof;
identifying a first potentially-defective analysis segment at a first location on the first patterned substrate using the defect analysis data, wherein the first potentially-defective analysis segment defines a three-dimensional volume that includes the first defect type;
calculating first Pooled Polymer De-protection Variance [(PPDV,σ
m)]Calc data for the first potentially-defective analysis segment, wherein (m) is a simulation parameter and (σ
m) is a standard deviation of the simulation parameter (m);
obtaining first estimated [(PPDV,σ
m)]Est data in real-time from a first Pooled Polymer De-protection Variance (PPDV,σ
m) data library to compare with the first calculated [(PPDV,σ
m)]Calc data, wherein the [(PPDV,σ
m)]data comprises analysis variable data (AVD), average value (<
AVD>
) data, simulation data, photoresist model data, integrated circuit (IC) data, design rule data, processing sequence data, substrate data, evaluation zone data, or defect type data, or any combination thereof;
determining a first difference value using the first calculated [(PPDV,σ
m)]Calc data and the first estimated [(PPDV,σ
m)]Est data;
identifying a first defect in the first potentially-defective analysis segment on the first patterned substrate using at least one defect type associated with the first estimated [(PPDV,σ
m)]Est data, when the first difference value is less than or equal to a first accuracy limit; and
continuing to analyze the first patterned substrate, when the first difference value is greater than the first accuracy limit.
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Abstract
The invention provides apparatus and methods for processing substrates using pooled statistically based variance data. The statistically based variance data can include Pooled Polymer De-protection Variance (PPDV) data that can be used to determine micro-bridging defect data, LER defect data, and LWR defect data.
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Citations
20 Claims
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1. A method for processing a substrate using statistical variance data comprising:
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using a computer to perform the following; establishing a first defect type for analysis on a first patterned substrate selected from a group of patterned substrates, wherein the first defect type includes a micro-bridging defect, or a line edge roughness (LER) defect, or a line width roughness (LWR) defect; obtaining defect analysis data from a plurality of analysis segments on the first patterned substrate, wherein the defect analysis data includes bright-field data, dark-field data, NLS data, intensity data, intensity difference data, contrast data, or hot-spot data, or any combination thereof; identifying a first potentially-defective analysis segment at a first location on the first patterned substrate using the defect analysis data, wherein the first potentially-defective analysis segment defines a three-dimensional volume that includes the first defect type; calculating first Pooled Polymer De-protection Variance [(PPDV,σ
m)]Calc data for the first potentially-defective analysis segment, wherein (m) is a simulation parameter and (σ
m) is a standard deviation of the simulation parameter (m);obtaining first estimated [(PPDV,σ
m)]Est data in real-time from a first Pooled Polymer De-protection Variance (PPDV,σ
m) data library to compare with the first calculated [(PPDV,σ
m)]Calc data, wherein the [(PPDV,σ
m)]data comprises analysis variable data (AVD), average value (<
AVD>
) data, simulation data, photoresist model data, integrated circuit (IC) data, design rule data, processing sequence data, substrate data, evaluation zone data, or defect type data, or any combination thereof;determining a first difference value using the first calculated [(PPDV,σ
m)]Calc data and the first estimated [(PPDV,σ
m)]Est data;identifying a first defect in the first potentially-defective analysis segment on the first patterned substrate using at least one defect type associated with the first estimated [(PPDV,σ
m)]Est data, when the first difference value is less than or equal to a first accuracy limit; andcontinuing to analyze the first patterned substrate, when the first difference value is greater than the first accuracy limit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for verifying a set of design rules using pooled variance data comprising:
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using a computer to perform the following; establishing a first defect type for analysis on a patterned substrate created using a first set of design rules, wherein the first defect type is associated with the first set of design rules and includes a micro-bridging defect, or a line edge roughness (LER) defect, or a line width roughness (LWR) defect; obtaining defect analysis data from the patterned substrate, wherein the defect analysis data includes bright-field data, dark-field data, NLS data, intensity data, intensity difference data, contrast data, or hot-spot data, or any combination thereof; identifying a first potentially-defective analysis segment at a first location on the patterned substrate using the defect analysis data, wherein the first potentially-defective analysis segment defines a three-dimensional volume that includes the first defect type; calculating first Pooled Polymer De-protection Variance [(PPDV,σ
m)]Calc data for the first potentially-defective analysis segment, wherein (m) is a simulation parameter and (σ
m) is a standard deviation of the simulation parameter (m);obtaining first estimated [(PPDV,σ
m)]Est data in real-time from at least one Pooled Polymer De-protection Variance (PPDV,σ
m) data library to compare with the first calculated [(PPDV,σ
m)]Calc data, wherein the first [(PPDV,σ
m)]Est data comprises historical data that includes a first set of defective design rules, at least one first defect type associated with the first set of defective design rules, and a first defective integrated circuit (IC) pattern associated with the first set of defective design rules;identifying the first set of design rules as defective design rules using the first set of defective design rules, when the first estimated [(PPDV,σ
m)]Est data is substantially equal to the first calculated [(PPDV,σ
m)]Calc data; andcontinuing to analyze the patterned substrate, when the first estimated [(PPDV,σ
m)]Est data is not equal to the first calculated [(PPDV,σ
m)]Calc data. - View Dependent Claims (12, 13, 14, 15)
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16. A method for creating pooled variance data comprising:
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using a computer to perform the following; a) selecting an (ith) potentially defective Integrated Circuit (IC) pattern from a group of (I) different potentially defective IC patterns, wherein i=1,2, . . . I, and (I) is an integer greater than one; b) selecting a (jith) set of process parameters from a group of (Ji) different sets of process parameters, wherein i=1,2, . . . I, (j=1,2, . . . Ji), and (Ji) is an integer greater than one; c) selecting a kijth data-collection substrate (Sijk) from a group of (Kij) data-collection substrates, wherein (kij=1,2, . . . Kij), (i=1,2, . . . I), (j =1,2, . . . Ji) and (Kij) is an integer greater than one; d) processing the kijth data-collection substrate (Sijk) using the jith set of process parameters; e) obtaining at least one optical image from the kijth data-collection substrate (Sijk); f) selecting an [lth]i jk analysis segment from a group of (Lijk) analysis segments on the kijth data-collection substrate (Sijk), wherein (lijk=1,2, . . . Lijk),(i=1,2, . . . I), (j=1,2, . . . Ji), (k=1,2, . . . Kij), and (Lijk) is an integer greater than one, each processed data-collection substrates (Sijk) being divided into (Lijk) analysis segments, wherein each intensity difference spot in the at least one optical image is used to establish at least one of the group of (Lijk) analysis segments on each processed data-collection substrate (Sjk); g) selecting an [mth]ijkl simulation parameter from a group of (Mijkl) simulation parameters for each of the selected [lth]i jk analysis segment on each of the processed data-collection substrates (Sijk), wherein (mijkl=1,2, . . . Mijkl),(i=1,2, . . . I), (j=1,2, . . . Ji), (k=1,2, . . . Kij), (lijk=1,2, . . . Lijk), and (Mijkl) is an integer greater than one; h) creating an [mth]ijkl simulation data map using the selected [mth]ijkl simulation parameter and a modified photoresist model; i) selecting an [nth]ijklm evaluation zone in the [mth]ijkl simulation data map, wherein (i=1,2, . . . I), (j=1,2, . . . Ji), (k=1,2, . . . Kij), (lijk=1,2, . . . Lijk), (mijkl=1,2, . . . Mijk), and ([N]ijklm) is an integer greater than one; j) calculating at least one Analysis Variable Data ([AVDnth]ijklm) value, wherein (i=1,2, . . . I), (j=1,2, . . . Ji), (k=1,2, . . . Kij), (lijk=1,2, . . . Lijk), (mijkl=1,2, . . . Mijkl), and ([nth]ijklm=1,2, . . . [N]ijklm); k) determining if a data-collection procedure has been completed for the ([kth]ij) processed data-collection substrate (Sijk); l) obtaining additional data for the ([kth]ij) processed data-collection substrate (Sijk), when the data-collection procedure has not been completed; m) calculating Pooled Polymer De-protection Variance (PPDV,σ
m)data for the ([kth]ij) processed data-collection substrate (Sijk) when the data-collection procedure has been completed; andn) using the calculated Pooled Polymer De-protection data to improve circuit fabrication process yield. - View Dependent Claims (17, 18, 19, 20)
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Specification