Cleaning a hot soldering iron tip using dry melamine sponge

• US 8,109,430 B2
• Filed: 12/10/2010
• Issued: 02/07/2012
• Est. Priority Date: 04/29/2005
• Status: Expired due to Fees

• Current Assignee: Sukhvinder Singh Dhanjal
• Original Assignee: Sukhvinder Singh Dhanjal
• Inventors: Dhanjal, Sukhvinder Singh
• Primary Examiner(s): Ward, Jessica L
• Assistant Examiner(s): D'Aniello, Nicholas
• Application Number:
  US12/964,840
• Publication Number:
  US 20110132399A1
• Time in Patent Office: 424 Days
• Field of Search: 228/51
• US Class Current: 228/51
• CPC Class Codes: B23K 3/08 Auxiliary devices therefor cleaning pipes or tubes or systems of pipes or tubes, e.g. before soldering, B08B9/02
• CPC Class Codes: Y10T 428/24273 including aperture
• CPC Class Codes: Y10T 428/249978 Voids specified as micro

Abstract

In one aspect the invention provides a method of cleaning molten solder from the hot tip of a soldering iron that does not require a water-laden sponge. The hot tip of the iron is wiped against a block of dry open-celled melamine foam. The block is formed with an inclined through-hole that leads to the bottom of a receptacle holding the block. The hot tip is wiped against the foam surrounding an upper end of the through-hole, and the molten solder removed from the tip accumulates in the receptacle below.

Claims

1. A method of cleaning molten solder from the hot tip of a soldering iron without using water, comprising:

providing dry open-celled melamine foam; and

,

wiping the hot tip of the soldering iron against the dry open-celled melamine foam to remove molten solder from the hot tip.

2. The method of claim 1 in which:

the method comprises the preliminary step of forming the foam into a block with a through-hole inclined relative to vertical in the block; and

,

the wiping comprises locating the hot tip at an upper end of the through-hole and then contacting the hot tip against the foam surrounding the through-hole.

3. The method of claim 1 comprising the preliminary steps of:

shaping the foam into a block with an inclined forward surface in an upper portion of the block, an inclined rear surface in an lower portion of the block parallel to the forward surface, and a through-hole extending between the forward and rear surfaces; and

,

placing the block in a receptacle that cooperates with the rear surface to define a cavity for receiving molten solder.

4. The method of claim 1 further comprising applying heat to at least a first portion of the dry open-celled melamine foam such that the first portion of the block of open-celled melamine foam is at least partially more rigid than a second portion of the block of open-celled melamine foam.

5. The method of claim 1 further comprising applying heat and compression to at least a first portion of the dry open-celled melamine foam such that the first portion of the block of open-celled melamine foam is at least partially more rigid than a second portion of the block of open-celled melamine foam.

6. The method of claim 4 wherein the step of applying heat to at least the first portion of the dry open-celled melamine foam such that the first portion of the block of open-celled melamine foam is at least partially more rigid than a second portion of the block of open-celled melamine foam is performed before wiping the hot tip of the soldering iron against the foam.

7. The method of the claim 5 wherein the step of applying heat and compression to at least the first portion of the dry open-celled melamine foam such that the first portion of the block of open-celled melamine foam is at least partially more rigid than a second portion of the block of open-celled melamine foam is performed before wiping the hot tip of the soldering iron against the foam.

8. A method of removing molten solder from a soldering iron comprising:

receiving a soldering iron tip on a surface of a dry open-celled melamine foam;

the dry open-celled melamine foam rubbing against the soldering iron tip and removing molten solder therefrom without using water.

9. The method of claim 8, wherein the receiving the soldering iron tip comprises:

engaging the soldering iron tip with a hole extending from a surface of the dry open-celled melamine foam;

directing molten solder from the soldering iron tip toward a lower end of the hole when the soldering iron tip engages the dry open-celled melamine foam near an upper end of the hole;

wherein;

the hole comprises a through-hole;

top and bottom surfaces of the dry open-celled melamine foam are flat and parallel;

a forward face of the dry open-celled melamine foam comprises a lower surface which is flat and vertical and an upper portion which is inwardly inclined from vertical; and

a rear face of the dry open-celled melamine foam comprises an upper surface which is flat and vertical and a lower portion which is inwardly inclined from vertical;

the dry open-celled melamine foam is configured to be rotated 180 degrees about a horizontal axis; and

the through-hole extends from the upper portion of the forward face to lower portion of the rear face of the dry open-celled melamine foam.

10. The method of claim 8 further comprising receiving heat on at least a first portion of the dry open-celled melamine foam such that the first portion of the block of open-celled melamine foam is at least partially more rigid than a second portion of the block of open-celled melamine foam.

11. The method of the claim 8 wherein the receiving heat on at least the first portion of the dry open-celled melamine foam such that the first portion of the block of open-celled melamine foam is at least partially more rigid than a second portion of the block of open-celled melamine foam is performed before receiving the soldering iron tip against the dry open-celled melamine foam.