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Heat-reduction methods and systems related to microfluidic devices

  • US 8,110,158 B2
  • Filed: 10/14/2010
  • Issued: 02/07/2012
  • Est. Priority Date: 02/14/2001
  • Status: Active Grant
First Claim
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1. An integrated microfluidic processing system comprising a microfluidic device, the device comprising:

  • a microfluidic complex comprising at least one thermally actuated component, wherein at least one thermally actuated component is configured for moving fluid in the microfluidic device;

    a thermally insulating substrate comprising a heating element configured to actuate the thermally actuated component;

    at least one conductive lead for supplying electrical current from a current source to the heating element, wherein the lead has a lower current density that the heating element; and

    a Peltier cooler configured to remove heat from specific regions of the microfluidic complex.

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