Laser liftoff structure and related methods
First Claim
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1. A method of making a light emitting device, the method comprising:
- providing a first multi-layer stack, comprisinga substratea submount,a wide bandgap buffer region between the substrate and the submount, wherein the buffer region includes a dislocation reduction region comprising a superlattice semiconductor structure; and
a sacrificial portion between the buffer region and the submount; and
exposing the sacrificial portion to electromagnetic radiation to at least partially decompose the sacrificial portion; and
removing the substrate and at least part of the buffer region from the first multi-layer stack to form a second multi-layer stack,wherein the substrate and the buffer region are transparent to wavelengths of the electromagnetic radiation.
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Abstract
Light-emitting devices, and related components, systems, and methods associated therewith are provided.
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Citations
26 Claims
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1. A method of making a light emitting device, the method comprising:
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providing a first multi-layer stack, comprising a substrate a submount, a wide bandgap buffer region between the substrate and the submount, wherein the buffer region includes a dislocation reduction region comprising a superlattice semiconductor structure; and a sacrificial portion between the buffer region and the submount; and exposing the sacrificial portion to electromagnetic radiation to at least partially decompose the sacrificial portion; and removing the substrate and at least part of the buffer region from the first multi-layer stack to form a second multi-layer stack, wherein the substrate and the buffer region are transparent to wavelengths of the electromagnetic radiation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of making a light emitting device, the method comprising:
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providing a first multi-layer stack, comprising; a substrate; a submount; a wide bandgap buffer region between the substrate and the submount, wherein the buffer region includes a dislocation reduction region, the dislocation reduction region has a varying composition across a thickness of the region, and the composition of at least one of the elements in the dislocation reduction region is graded across a thickness of the region; and a sacrificial portion between the buffer region and the submount; and exposing the sacrificial portion to electromagnetic radiation to at least partially decompose the sacrificial portion; and removing the substrate and at least part of the buffer region from the first multi-layer stack to form a second multi-layer stack, wherein the substrate and the buffer region are transparent to wavelengths of the electromagnetic radiation; and wherein the first multi-layer stack includes an n-doped region formed directly on the buffer region. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification