Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
First Claim
1. A method of making a semiconductor chip assembly, comprising:
- providing a post, a base, an adhesive and a conductive layer, whereinthe post is adjacent to the base, extends above the base in an upward direction, extends into an opening in the adhesive and is aligned with an aperture in the conductive layer,the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions,the adhesive is mounted on and extends above the base, contacts and is sandwiched between the base and the conductive layer and is non-solidified, andthe conductive layer is mounted on and extends above the adhesive;
thenflowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, wherein flowing the adhesive includes forcing the adhesive above the post and the conductive layer;
solidifying the adhesive;
thengrinding the adhesive;
thenproviding a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer;
mounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post;
electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and
thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base.
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Abstract
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
49 Citations
45 Claims
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1. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, an adhesive and a conductive layer, wherein the post is adjacent to the base, extends above the base in an upward direction, extends into an opening in the adhesive and is aligned with an aperture in the conductive layer, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the adhesive is mounted on and extends above the base, contacts and is sandwiched between the base and the conductive layer and is non-solidified, and the conductive layer is mounted on and extends above the adhesive;
thenflowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, wherein flowing the adhesive includes forcing the adhesive above the post and the conductive layer; solidifying the adhesive;
thengrinding the adhesive;
thenproviding a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer; mounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive alone; providing a conductive layer, wherein an aperture extends through the conductive layer alone; mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening; mounting the conductive layer on the adhesive, including aligning the post with the aperture, wherein the conductive layer extends above the adhesive and the adhesive contacts and is sandwiched between the base and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the conductive layer and flow above the post and the conductive layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the conductive layer;
thengrinding the adhesive;
thenproviding a conductive trace that includes a pad and a terminal, wherein the conductive trace includes selected portions of the conductive layer and an electrically conductive path is between the pad and the terminal; mounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive alone; providing a conductive layer, wherein an aperture extends through the conductive layer alone; mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening; mounting the conductive layer alone on the adhesive, including aligning the post with the aperture, wherein the conductive layer extends above the adhesive, the post extends into the opening and the adhesive contacts and is sandwiched between the base and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the conductive layer and flow above the post and the conductive layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the conductive layer;
thengrinding the adhesive;
thenproviding a conductive trace that includes a pad and a terminal, including removing selected portions of the conductive layer using an etch mask that defines the pad and the terminal, wherein the pad and the terminal include selected portions of the conductive layer and an electrically conductive path is between the pad and the terminal;
thenmounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (22, 23, 24, 25)
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26. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive alone; providing a conductive layer, wherein an aperture extends through the conductive layer alone; mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening; mounting the conductive layer on the adhesive, including aligning the post with the aperture, wherein the conductive layer extends above the adhesive and the adhesive contacts and is sandwiched between the base and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the conductive layer and flow above the post and the conductive layer onto top surfaces of the post and the conductive layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the conductive layer;
thengrinding the post and the adhesive;
thenproviding a conductive trace that includes a pad and a terminal, wherein the conductive trace includes selected portions of the conductive layer and an electrically conductive path is between the pad and the terminal; providing a cap on the post that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and that overlaps and is adjacent to the adhesive, wherein a heat spreader includes the post, the base and the cap;
thenmounting a semiconductor device on the cap, wherein the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive alone; providing a conductive layer, wherein an aperture extends through the conductive layer alone; mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening; mounting the conductive layer on the adhesive, including aligning the post with the aperture, wherein the conductive layer extends above the adhesive and the adhesive contacts and is sandwiched between the base and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the conductive layer and flow laterally into the post; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the conductive layer;
thendepositing a second conductive layer on the post, the adhesive and the conductive layer;
thenproviding a conductive trace that includes a pad and a terminal, including etching the conductive layers such that the pad includes selected portions of the conductive layers; providing a cap on the post that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and that overlaps and is adjacent to the adhesive, including etching the second conductive layer such that the cap includes a selected portion of the second conductive layer;
thenmounting a semiconductor device on a heat spreader that includes the post, the base and the cap, wherein the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45)
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Specification