Printed TFT and TFT array with self-aligned gate
First Claim
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1. A method of configuring a self-aligning thin film transistor comprising:
- forming a gate contact area with a state-switchable material that is initially non-conductive;
forming a gate dielectric which isolates the gate contact area;
forming a source-drain layer, including a source contact and a drain contact with a source-drain layer material;
exposing a portion of the gate contact area to a form of energy, wherein the energy transforms a portion of the state-switchable material which corresponds to the exposed portion of the gate contact area, turning the exposed portion of the state-switchable material from non-conductive to conductive and the exposed portion of the gate contact area to a gate contact, wherein at least some of the state-switchable material is covered by the drain contact and the source contact, and the drain contact and the source contact block the energy from reaching the portion of the state-switchable material located under the drain contact and the source contact, maintaining at least a portion of the state-switchable material as non-conductive; and
forming a semi-conductor layer of a semiconductor material between the source contact and the drain contact.
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Abstract
A method is used to form a self-aligning thin film transistor. The thin film transistor includes a gate contact formed with a state-switchable material, and a dielectric layer to isolate the gate contact. A source-drain layer, which includes a source contact, and a drain contact are formed with a source-drain material. An area of the gate contact is exposed to a form of energy, wherein the energy transforms a portion of the state switchable material from a non-conductive material to a conductive material, the conductive portion defining the gate contact. A semiconductor material is formed between the source contact and the drain contact.
20 Citations
22 Claims
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1. A method of configuring a self-aligning thin film transistor comprising:
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forming a gate contact area with a state-switchable material that is initially non-conductive; forming a gate dielectric which isolates the gate contact area; forming a source-drain layer, including a source contact and a drain contact with a source-drain layer material; exposing a portion of the gate contact area to a form of energy, wherein the energy transforms a portion of the state-switchable material which corresponds to the exposed portion of the gate contact area, turning the exposed portion of the state-switchable material from non-conductive to conductive and the exposed portion of the gate contact area to a gate contact, wherein at least some of the state-switchable material is covered by the drain contact and the source contact, and the drain contact and the source contact block the energy from reaching the portion of the state-switchable material located under the drain contact and the source contact, maintaining at least a portion of the state-switchable material as non-conductive; and forming a semi-conductor layer of a semiconductor material between the source contact and the drain contact. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of configuring a self-aligning thin film transistor comprising:
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forming a gate contact area with a state-switchable material that is initially non-conductive; forming a gate dielectric which isolates the gate contact area; forming a source-drain layer, including a source contact and a drain contact with a source-drain layer material; exposing a portion of the gate contact area to an electromagnetic form of energy, wherein the electromagnetic energy transforms a portion of the state-switchable material which corresponds to the exposed portion of the gate contact area, turning the exposed portion of the state-switchable material from non-conductive to conductive and the exposed portion of the gate contact area to a gate contact; and forming a semi-conductor layer of a semiconductor material between the source contact and the drain contact, wherein the drain contact and the source contact act to block the source of energy from reaching the portion of the state-switchable material covered by the drain contact and the source contact, wherein the covered portion of the state-switchable material remains non-conductive and the exposed portion of the state-switchable material is made conductive. - View Dependent Claims (14, 15, 16, 17)
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18. A method of configuring a self-aligning thin film transistor comprising:
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forming a gate contact area with a state-switchable material that is initially non-conductive; forming a gate dielectric which isolates the gate contact area; forming a source-drain layer, including a source contact and a drain contact with a source-drain layer material; exposing a portion of the gate contact area to an electromagnetic form of energy, wherein the electromagnetic energy transforms a portion of the state-switchable material which corresponds to the exposed portion of the gate contact area, turning the exposed portion of the state-switchable material from non-conductive to conductive and the exposed portion of the gate contact area to a gate contact; and forming a semi-conductor layer of a semiconductor material between the source contact and the drain contact, wherein the drain contact and source contact act as a mask to allow only portions of the state-switchable material of the gate contact area which do not overlap the drain contact and the source contact to be switched to a conducting state, causing the gate contact, source contact and drain contact to self-align without overlap. - View Dependent Claims (19, 20, 21, 22)
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Specification