Miscut semipolar optoelectronic device
First Claim
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1. A semiconductor film, comprising:
- a semipolar nitride semiconductor film deposited on a miscut surface of a substrate, wherein a top surface of the semipolar nitride semiconductor film is more than 10 microns wide and is substantially parallel to the miscut surface of the substrate.
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Abstract
A method for improved growth of a semipolar (Al,In,Ga,B)N semiconductor thin film using an intentionally miscut substrate. Specifically, the method comprises intentionally miscutting a substrate, loading a substrate into a reactor, heating the substrate under a flow of nitrogen and/or hydrogen and/or ammonia, depositing an InxGa1-xN nucleation layer on the heated substrate, depositing a semipolar nitride semiconductor thin film on the InxGa1-xN nucleation layer, and cooling the substrate under a nitrogen overpressure.
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Citations
38 Claims
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1. A semiconductor film, comprising:
a semipolar nitride semiconductor film deposited on a miscut surface of a substrate, wherein a top surface of the semipolar nitride semiconductor film is more than 10 microns wide and is substantially parallel to the miscut surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of fabricating a semiconductor film, comprising:
depositing a semipolar nitride semiconductor film on a miscut surface of a substrate, wherein a top surface of the semipolar nitride semiconductor film is more than 10 microns wide and is substantially parallel to the miscut surface of the substrate. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
Specification