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Mobile telecommunication terminal

  • US 8,111,194 B2
  • Filed: 11/23/2007
  • Issued: 02/07/2012
  • Est. Priority Date: 11/22/2006
  • Status: Expired due to Fees
First Claim
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1. A mobile telecommunication terminal, comprising:

  • a chip antenna comprising;

    a dielectric block shaped as a rectangular parallelepiped and having opposing top and bottom surfaces and first through fourth side surfaces connecting the top and bottom surfaces, wherein the second side surface is opposing the first side surface of the dielectric block;

    a first conductive pattern formed on the first side surface of the dielectric block to be connected to an external feeding part;

    a second conductive pattern formed across the second side surface and the top surface of the dielectric block, wherein the second conductive pattern is spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to define a radiator, and wherein the second conductive pattern has one end connected to an external ground part; and

    a third conductive pattern formed on the bottom surface of the dielectric block, wherein the third conductive pattern is spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to enable impedance matching of the chip antenna, and wherein the third conductive pattern has a lower end connected to the external ground part, anda printed circuit board having the chip antenna mounted on one surface thereof, the printed circuit board comprising a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board, the tuning ground pattern having one end connected to the external ground part for tuning frequency characteristics of the chip antenna,wherein a coupling capacitance between the first and second conductive patterns is greater than a coupling capacitance between the first and third conductive patterns,wherein a length of the third conductive pattern is determined to adjust the impedance matching of the chip antenna and to result in a corresponding variation in a resonant frequency of the chip antenna, andwherein the coupling capacitance between the first and third conductive patterns is greater than a coupling capacitance between the second and third conductive patterns.

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