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Method and apparatus for performing model-based OPC for pattern decomposed features

  • US 8,111,921 B2
  • Filed: 09/13/2007
  • Issued: 02/07/2012
  • Est. Priority Date: 09/13/2006
  • Status: Active Grant
First Claim
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1. A method for decomposing a target circuit pattern containing features to be printed on a wafer, into multiple patterns, comprising the steps of:

  • separating said features to be printed into a first pattern and a second pattern;

    performing a first optical proximity correction process on said first pattern and said second pattern;

    determining an imaging performance of said first pattern and said second pattern;

    determining a first error between said first pattern and said imaging performance of said first pattern, and a second error between said second pattern and said imaging performance of said second pattern;

    utilizing said first error to adjust stitching areas associated with said first pattern to generate a modified first pattern;

    utilizing said second error to adjust stitching areas associated with said second pattern to generate a modified second pattern; and

    applying a second optical proximity correction process to said modified first pattern and said modified second pattern.

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