Method and apparatus for manufacturing electronic circuit board

• US 8,112,883 B2
• Filed: 06/10/2008
• Issued: 02/14/2012
• Est. Priority Date: 06/15/2007
• Status: Expired due to Fees

• Current Assignee: Panasonic Liquid Crystal Display Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Hitachi Displays Limited (Japan Display Incorporated), Panasonic Liquid Crystal Display Company Limited (Panasonic Holdings Corporation)
• Inventors: Nakasu, Nobuaki
• Primary Examiner(s): Banks, Derris
• Assistant Examiner(s): Carley, Jeffrey T
• Application Number:
  US12/136,148
• Publication Number:
  US 20080313893A1
• Time in Patent Office: 1,344 Days
• Field of Search: 298/30, 298/46, 298/47, 297/01, 295/663, 297/03, 297/05, 297/09, 297/31, 382/149, 700/121, 700/124
• US Class Current: 29/847
• CPC Class Codes: G02F 1/136254 Checking; Testing
• CPC Class Codes: G02F 1/136259 Repairing; Defects
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H05K 3/225 Correcting or repairing of printed circuits H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/515 to trim electric component
• CPC Class Codes: Y10T 29/53004 with means to regulate operation by use of templet, tape, card or other replaceable information supply

Abstract

A method for manufacturing an electronic circuit board which contains an electronic circuit on a main surface of a glass substrate according to the invention sequentially performs a step of electrically inspecting the main surface of the glass substrate on which the electronic circuit is formed, a step of specifying positions and defect types of defects on the main surface of the glass substrate, a step of calculating reference point coordinates on the main surface of the glass substrate and correcting the coordinates, a step of extracting respective defects from an image around the defects and specifying a defect to be corrected in the extracted defects by referring to a defect existing range registered in advance for each defect type, and a step of cutting the specified defect. By this method, a foreign material adhering to the glass substrate is not erroneously judged as short-circuit defect causing short-circuit on the electronic circuit, and only defect actually requiring correction can be removed.

Claims

1. An apparatus for manufacturing an electronic circuit board on which are provided a plurality of first wirings placed side by side, a plurality of second wirings placed in a direction across from the plurality of the first wirings, and electric circuit patterns formed as a combination of the plurality of the first wirings and the plurality of the second wirings, comprising:

a defect detecting part detects a defect by electrically inspecting each of the plurality of the first wirings and the plurality of the second wirings and specifies an electric circuit pattern which has the defect;

a defect-type specifying part specifies a type of the defect in the electric circuit pattern which has been detected through the electric inspection;

a defect position specifying part acquires an image of the specifying electric circuit pattern that contains the defect and detects a position of the defect in the acquired image;

a modification specifying part selects a defect existing region information stored in a storage device according to the type of the defect and determines a method of correcting the defect by comparing the position of the defect to the defect existing region information; and

a defect correcting part corrects a defect existing area,

wherein each of the plurality of the first wirings and each of the plurality of the second wirings forms data wirings and gate wirings;

wherein specific position numbers of the gate wirings and the data wirings determines a location of a short-circuit; and

wherein the defect type is specified according to which data wirings and gate wirings causes the short circuit.

2. The apparatus for manufacturing an electronic circuit board according to the claim 1, wherein the defect is caused by shortage of insulating characteristics of an insulating film.

3. The apparatus for manufacturing an electronic circuit board according to the claim 1, wherein the defect existing region information combines information related to a region in the electric circuit pattern, a defect that occurs in the region, and a method of modification of the defect.

4. The apparatus for manufacturing an electronic circuit board according to the claim 1, wherein the modification specifying part selects a cutting position stored in the storage device in advance based on the defect existing area and the defect type.

5. The apparatus for manufacturing an electronic circuit board according to the claim 1, further comprising:

a modification completion determining part determines whether or not to complete the modification by acquiring an image of a modified region of an electric circuit.