Optical module and method for manufacturing same

• US 8,113,725 B2
• Filed: 09/22/2009
• Issued: 02/14/2012
• Est. Priority Date: 05/26/2009
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tagami, Yuichi
• Primary Examiner(s): Hahm, Sarah
• Application Number:
  US12/564,274
• Publication Number:
  US 20100303405A1
• Time in Patent Office: 875 Days
• Field of Search: None
• US Class Current: 385/92
• CPC Class Codes: G02B 6/4206 Optical features G02B6/4207, G02B6/421 take precedence
• CPC Class Codes: G02B 6/4228 Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements G02B6/4234 takes precedence
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2933/0058 : relating to optical field-shaping elements
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements

Abstract

An optical module includes: an optical semiconductor section including a first lead, a second lead with one end portion opposed to one end portion of the first lead, an optical semiconductor element bonded onto the first lead, and a first molded body in which the optical semiconductor element, the one end portion of the first lead, and the one end portion of the second lead are embedded; and an optical element section including a third lead, a fourth lead with one end portion opposed to one end portion of the third lead, and a second molded body in which the one end portion of the third lead and the one end portion of the fourth lead are embedded and which can change the optical path of at least one of emitted light from the optical semiconductor element and incident light on the optical semiconductor element. The other end portion of the first lead and the other end portion of the second lead protrude from the first molded body in directions opposite to each other. The other end portion of the third lead and the other end portion of the fourth lead protrude from the second molded body in directions opposite to each other. The protruding first lead and the protruding third lead are joined to form a metal junction. The protruding second lead and the protruding fourth lead are joined to form a metal junction. And at least one of the first and second leads and the third and fourth leads have a bent portion which is convex outward.

Claims

1. An optical module comprising:

an optical semiconductor section including a first lead, a second lead with one end portion opposed to one end portion of the first lead, an optical semiconductor element bonded onto the first lead, and a first molded body in which the optical semiconductor element, the one end portion of the first lead, and the one end portion of the second lead are embedded; and

an optical element section including a third lead, a fourth lead with one end portion opposed to one end portion of the third lead, and a second molded body in which the one end portion of the third lead and the one end portion of the fourth lead are embedded and which can change the optical path of at least one of emitted light from the optical semiconductor element and incident light on the optical semiconductor element,

the other end portion of the first lead and the other end portion of the second lead protruding from the first molded body in directions opposite to each other,

the other end portion of the third lead and the other end portion of the fourth lead protruding from the second molded body in directions opposite to each other,

the protruding first lead and the protruding third lead being joined to form a metal junction,

the protruding second lead and the protruding fourth lead being joined to form a metal junction, and

at least one of the first and second leads and the third and fourth leads having a bent portion which is convex outward.

2. The optical module according to claim 1, wherein

the optical semiconductor element is a light emitting element, and

the second molded body has a converging lens surface.

3. The optical module according to claim 2, wherein the third and fourth leads have a bent portion which is convex outward.

4. The optical module according to claim 2, wherein the first molded body has a converging lens surface.

5. The optical module according to claim 1, wherein the optical semiconductor element is a light receiving element.

6. The optical module according to claim 1, wherein the first molded body and the second molded body are made of one of acrylic resin, epoxy resin, and phenol resin, respectively.

13. The optical module according to claim 1, wherein the second molded body can change the optical path of the optical semiconductor element so that the optical path is generally parallel to a surface to which the optical semiconductor element is bonded.

14. The optical module according to claim 13, wherein

the optical semiconductor element is a light emitting element, and

the second molded body has a folded mirror surface.

15. The optical module according to claim 14, wherein the second molded body further includes a converging lens surface.

16. The optical module according to claim 14, wherein

the light emitting element is made of a nitride material, and

the first molded body includes dispersed phosphor particles which can absorb the emitted light from the light emitting element and emit wavelength-converted light.

7. An optical module comprising:

an optical semiconductor section including a first lead, a second lead with one end portion opposed to one end portion of the first lead, an optical semiconductor element bonded onto the first lead, and a first molded body in which the optical semiconductor element, the one end portion of the first lead, and the one end portion of the second lead are embedded;

an optical element section including a third lead, a fourth lead with one end portion opposed to one end portion of the third lead, and a second molded body in which the one end portion of the third lead and the one end portion of the fourth lead are embedded and which can converge at least one of emitted light from the optical semiconductor element and incident light on the optical semiconductor element; and

a ferrule guide portion including a fitting portion fitted with the second molded body and a through hole in which an optical fiber can be inserted,

the other end portion of the first lead and the other end portion of the second lead protruding from the first molded body in directions opposite to each other,

the other end portion of the third lead and the other end portion of the fourth lead protruding from the second molded body in directions opposite to each other,

the protruding first lead and the protruding third lead being joined to form a metal junction,

the protruding second lead and the protruding fourth lead being joined to form a metal junction, and

at least one of the first and second leads and the third and fourth leads having a bent portion which is convex outward.

8. The optical module according to claim 7, wherein

the optical semiconductor element is a light emitting element, and

the second molded body has a converging lens surface.

9. The optical module according to claim 8, wherein the third and fourth leads have a bent portion which is convex outward.

10. The optical module according to claim 8, wherein the first molded body has a converging lens surface.

11. The optical module according to claim 8, wherein an integrated circuit capable of driving the light emitting element is embedded in the first molded body.

12. The optical module according to claim 7, wherein the optical semiconductor element is a light receiving element.

17. A method for manufacturing an optical module, comprising:

bonding an optical semiconductor element onto a first lead of a first lead frame region which includes the first lead, a second lead with one end portion opposed to one end portion of the first lead, and a frame portion supporting the first and second lead;

forming a first molded body so that the one end portion of the first lead, the one end portion of the second lead, and the optical semiconductor element are embedded therein and that the other end portion of the first lead and the other end portion of the second lead protrude therefrom in directions opposite to each other;

forming a second molded body, on a second lead frame region which includes a third lead, a fourth lead with one end portion opposed to one end portion of the third lead, and a frame portion supporting the third and fourth lead, so that the one end portion of the third lead and the one end portion of the fourth lead are embedded therein and that the other end portion of the third lead and the other end portion of the fourth lead protrude therefrom in directions opposite to each other;

forming a metal junction by joining the first and third leads with the second and fourth leads while aligning a guide hole provided in the frame portion of the first lead frame region with a guide hole provided in the frame portion of the second lead frame region;

cutting the first and second leads away from the frame portion of the first lead frame region; and

cutting the third and fourth leads away from the frame portion of the second lead frame region.

18. The method for manufacturing an optical module according to claim 17, wherein

the first lead frame region and the second lead frame region are provided adjacently in a lead frame, and

the forming a metal junction includes superposing the first lead frame region and the second lead frame region by folding the lead frame.

19. The method for manufacturing an optical module according to claim 17, wherein

the first lead frame region is provided in a first lead frame,

the second lead frame region is provided in a second lead frame, and

the forming a metal junction includes superposing the first and second lead frames.

20. The method for manufacturing an optical module according to claim 17, wherein the forming a metal junction uses one method of YAG laser light irradiation, resistance welding, thermocompression bonding, ultrasonic bonding, and brazing.