Dynamic interspinous process device

• US 8,114,132 B2
• Filed: 01/13/2010
• Issued: 02/14/2012
• Est. Priority Date: 01/13/2010
• Status: Active Grant

• Current Assignee: Kyphon SARL (Medtronic Plc)
• Original Assignee: Kyphon SARL (Medtronic Plc)
• Inventors: Lyons, Lauren I., Phan, Christopher U.
• Primary Examiner(s): Robert, Eduardo C.
• Assistant Examiner(s): NEGRELLI, CHRISTINA L
• Application Number:
  US12/687,074
• Publication Number:
  US 20110172709A1
• Time in Patent Office: 762 Days
• Field of Search: 606246-249, 623 1711- 1716
• US Class Current: 606/249
• CPC Class Codes: A61B 17/7068 Devices comprising separate rigid parts, assembled in situ, to bear on each side of spinous processes; Tools therefor

Abstract

Medical devices for the treatment of spinal conditions are described herein. The medical device includes a pair of superior plates with spikes adapted to be embedded in a superior spinous process and a pair of inferior plates with spikes adapted to be embedded in an adjacent inferior spinous process. The superior plates and inferior plates are connected to each other in such a way as to allow relative motion therebetween. A spacer may be disposed between the adjacent spinous processes.

Claims

1. A device, comprising:

a first superior plate having a first inferior portion;

a second superior plate having a second inferior portion;

a first inferior plate having a first superior portion;

a second inferior plate having a second superior portion;

a first joint connecting the first inferior portion of the first superior plate to the first superior portion of the first inferior plate;

a second joint connecting the second inferior portion of the second superior plate to the second superior portion of the second inferior plate;

a plurality of spikes located along interior portions of the first superior plate and the second superior plate and along interior portions of the first inferior plate and the second inferior plate;

wherein the first and second joints are flexible;

wherein a first theoretical centerline intersects the first inferior portion of the first superior plate, the first superior portion of the first inferior plate, and the first joint;

wherein a second theoretical centerline intersects the second inferior portion of the second superior plate, the second superior portion of the inferior plate, and the second joint.

2. The device of claim 1 wherein the first and second superior plates are moveable in three planes relative to the first and second inferior plates respectively.

3. The device of claim 1 wherein the first and second joints are non-lockable.

4. The device of claim 1 further comprising a spacer disposed between the first superior plate and the second superior plate or between the first inferior plate and the second inferior plate.

5. The device of claim 1 wherein the first and second joints are molded around the first and second inferior portions of the first and second superior plates respectively and molded around the first and second superior portions of the first and second inferior plates respectively.

6. The device of claim 1 wherein the first and second inferior portions and the first and second superior portions are dovetailed direction.

7. The device of claim 1 wherein a first woven material is disposed over an outer surface of the first joint and a second woven material is disposed over an outer surface of the second joint.

8. The device of claim 1 wherein the first joint is a first spring and the second joint is a second spring.

9. The device of claim 8 wherein the first spring and the second spring are both compression springs.

10. The device of claim 8 wherein the first spring and the second spring are both torsion springs.

11. A device, comprising:

a first superior plate having a first inferior portion;

a second superior plate having a second inferior portion;

a first inferior plate having a first superior portion;

a second inferior plate having a second superior portion;

a first universally directional joint connecting the first inferior portion of the first superior plate to the first superior portion of the first inferior plate;

a second universally directional joint connecting the second inferior portion of the second superior plate to the second superior portion of the second inferior plate;

a plurality of spikes located along an interior portion of the first superior plate and the second superior plate and along the interior portions of the first inferior plate and the second inferior plate;

wherein the interior portion of the plates extends transverse to the inferior and superior portions of the respective plates;

wherein a first theoretical centerline intersects the first inferior portion of the first superior plate, the first superior portion of the first inferior plate, and the first joint;

wherein a second theoretical centerline intersects the second inferior portion of the second superior plate, the second superior portion of the second inferior plate, and the second joint.

12. The device of claim 11 wherein the first and second superior plates are moveable in three planes relative to the first and second inferior plates respectively.

13. The device of claim 11 wherein a first woven material disposed over an outer surface of the first joint and a second woven material disposed over an outer surface of the second joint.

14. The device of claim 11 wherein the first joint is a first spring and the second joint is a second spring.

15. The device of claim 14 wherein the first spring and the second spring are both compression springs.

16. The device of claim 14 wherein the first spring and the second spring are both torsion springs.

17. The device of claim 11 wherein the first joint is a first ball joint and the second joint is a second ball joint.

18. The device of claim 17 wherein the first ball joint includes a first ball have generally flat lateral sides and the second ball joint includes a second ball having generally flat lateral sides.

19. The device of claim 11 wherein the first and second joints are non-lockable.

20. The device of claim 11 wherein the first and second joints are molded around the first and second inferior portions of the first and second superior plates respectively and molded around the first and second superior portions of the first and second inferior plates respectively.

21. The device of claim 11 wherein the first and second inferior portions and the first and second superior portions are dovetailed.