Thickness distribution control for electroplating
First Claim
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1. A method for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object in an electroplating process, which method comprises:
- a) immersing in an electroplating bath multiple anodes and an object to be electroplated and to act as a cathode;
b) providing(i) elements with electrically adjustable resistance,(ii) ampere-hour meters each of which is in serial connection with one of said anodes and one of said elements with electrically adjustable resistance, wherein each of said ampere-hour meters measures and records the deposition and thickness of the electroplated material in an area on the object which faces the anode to which said ampere-hour meter is connected; and
(iii) a controller connected to said elements with electrically adjustable resistance and said ampere-hour meters;
c) providing compiled deposition data by the ampere-hour meters to the controller; and
d) sending signals from the controller to the elements with electrically adjustable resistance based on the difference between the compiled data and the desired thickness distribution, to monitor, control, and adjust the thickness distribution of the electroplated material on the object.
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Abstract
The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with electrically adjustable resistance, and ampere-hour meters. The invention is further directed to methods for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object. The object can be of any shape as long as it can electrically charged.
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Citations
3 Claims
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1. A method for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object in an electroplating process, which method comprises:
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a) immersing in an electroplating bath multiple anodes and an object to be electroplated and to act as a cathode; b) providing (i) elements with electrically adjustable resistance, (ii) ampere-hour meters each of which is in serial connection with one of said anodes and one of said elements with electrically adjustable resistance, wherein each of said ampere-hour meters measures and records the deposition and thickness of the electroplated material in an area on the object which faces the anode to which said ampere-hour meter is connected; and (iii) a controller connected to said elements with electrically adjustable resistance and said ampere-hour meters; c) providing compiled deposition data by the ampere-hour meters to the controller; and d) sending signals from the controller to the elements with electrically adjustable resistance based on the difference between the compiled data and the desired thickness distribution, to monitor, control, and adjust the thickness distribution of the electroplated material on the object. - View Dependent Claims (2, 3)
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Specification
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Current AssigneeE Ink Corporation (E Ink Holdings Incorporated)
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Original AssigneeSiPix Imaging, Inc. (E Ink Holdings Incorporated)
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InventorsKang, Gary Yih-Ming, Chaug, Yi-Shung
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Primary Examiner(s)Neckel, Alexa
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Assistant Examiner(s)LEADER, WILLIAM T
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Application NumberUS11/621,890Publication NumberTime in Patent Office1,861 DaysField of Search205/82, 205/83, 205/84, 205/96, 204/227.8, 204/DIG.7US Class Current205/84CPC Class CodesC25D 17/007 Current directing devicesC25D 17/008 Current shielding devicesC25D 17/10 Electrodes , e.g. compositi...C25D 21/12 Process control or regulati...C25D 5/04 Electroplating with moving ...
