Camera modules and methods of fabricating the same
First Claim
1. A method of fabricating a camera module, the method comprising:
- preparing a first wafer including an array of lens units;
preparing a second wafer including an array of image sensor chip-scale packages (CSPs), each image sensor CSP including an image sensor chip corresponding to one of the lens units, wherein a ground pad is formed on the top surface of the image sensor chip and a through via connected to the ground pad is formed through the image sensor chip;
stacking the first wafer on the second wafer;
cutting the first wafer and the second wafer to form a trench exposing the ground pad on the top surface of the image sensor chip at an interface between adjacent lens units;
filling the trench with a first material used for forming a camera module housing, wherein the first material includes a conductive material that contacts the ground pad, such that the camera module housing contacts the ground pad, and wherein the filling of the trench with the first material comprises filling the trench with the first material to an outer portion of the lens unit by which light is cut off so as to form an aperture in the lens unit; and
cutting the first material and the image sensor chip at the interface between the adjacent lens units.
1 Assignment
0 Petitions
Accused Products
Abstract
Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first wafer including an array of lens units. Then, a second wafer including an array of image sensor CSPs (chip-scale packages) is prepared. Each of the image sensor CSPs includes an image sensor chip corresponding to one of the lens units. The first wafer is stacked on the second wafer. The first wafer and the second wafer are cut to form a trench exposing the top surface of the image sensor chip at the interface between adjacent lens units. The trench is filled with a first material used for forming a housing. The first material and the image sensor chip are cut at the interface between the adjacent lens units.
11 Citations
20 Claims
-
1. A method of fabricating a camera module, the method comprising:
-
preparing a first wafer including an array of lens units; preparing a second wafer including an array of image sensor chip-scale packages (CSPs), each image sensor CSP including an image sensor chip corresponding to one of the lens units, wherein a ground pad is formed on the top surface of the image sensor chip and a through via connected to the ground pad is formed through the image sensor chip; stacking the first wafer on the second wafer; cutting the first wafer and the second wafer to form a trench exposing the ground pad on the top surface of the image sensor chip at an interface between adjacent lens units; filling the trench with a first material used for forming a camera module housing, wherein the first material includes a conductive material that contacts the ground pad, such that the camera module housing contacts the ground pad, and wherein the filling of the trench with the first material comprises filling the trench with the first material to an outer portion of the lens unit by which light is cut off so as to form an aperture in the lens unit; and cutting the first material and the image sensor chip at the interface between the adjacent lens units. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
-
15. A method of fabricating a camera module, the method comprising:
-
preparing a first wafer substrate including an array of lens units mounted thereon, each lens unit of the array disposed a predetermined distance in a horizontal direction from an adjacent lens unit of the array; preparing a second wafer substrate including an array of image sensor chip-scale packages (CSPs) mounted thereon, each image sensor CSP including an image sensor chip corresponding to one of the lens units, wherein a ground pad is formed on the top surface of the image sensor chip and a through via connected to the ground pad is formed through the image sensor chip; stacking the first wafer on the second wafer; cutting the first wafer and the second wafer to form a trench exposing the ground pad on the top surface of the image sensor chip at an interface between adjacent lens units; filling the trench with a first material used for forming a camera module housing, wherein the first material includes a conductive material that contacts the ground pad, such that the camera module housing contacts the ground pad; and cutting the first material and the image sensor chip at the interface between the adjacent lens units. - View Dependent Claims (16, 17, 18, 19)
-
-
20. A method of fabricating a camera module, the method comprising:
-
preparing a first wafer substrate including an array of lens units mounted thereon, each lens unit of the array disposed a predetermined distance in a horizontal direction from an adjacent lens unit of the array; preparing a second wafer substrate including an array of image sensor chip-scale packages (CSPs) mounted thereon, each image sensor CSP including an image sensor chip corresponding to one of the lens units, wherein a ground pad is formed on the top surface of the image sensor chip and a through via connected to the ground pad is formed through the image sensor chip; stacking the first wafer on the second wafer; cutting the first wafer and the second wafer at an interface between adjacent lens units to form trenches exposing the ground pad on the top surface of each image sensor chip; filling each trench with a first material used for forming a camera module housing, wherein the first material includes a conductive material that contacts the ground pad, such that the camera module housing contacts the ground pad, and wherein the camera module housing formed of the first material extends to a top surface of the corresponding lens unit to form an aperture; and cutting the first material and the image sensor chip in a single process at the interface between the adjacent lens units to form the camera module.
-
Specification