Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip
First Claim
1. A method of forming a multi-chip assembly of semiconductor chips comprising:
- forming a stacked substrate assembly by bonding a semiconductor substrate to a temporary substrate through an array of first solder balls that bonds to an array of first solder pads on said semiconductor substrate;
dicing said stacked substrate assembly to form a plurality of stacked temporary structures, each of said plurality of stacked temporary structures comprising a first semiconductor chip that is a portion of said semiconductor substrate and a handle portion that is a portion of said temporary substrate;
bonding a second semiconductor chip to a stacked temporary structure among said plurality of stacked temporary structures, wherein an array of second solder balls is bonded to an array of second solder pads located on a first semiconductor chip in said stacked temporary structure and an array of third solder pads located on said second semiconductor chip;
detaching a handle portion from said stacked temporary structure to form a stacked semiconductor chip structure; and
forming a multi-chip assembly of semiconductor chips by bonding at least one stacked semiconductor chip structure including said stacked semiconductor chip structure to a packaging substrate.
7 Assignments
0 Petitions
Accused Products
Abstract
A temporary substrate having an array of first solder pads is bonded to the front side of a first substrate by reflowing an array of first solder balls. The first substrate is thinned by removing the back side, and an array of second solder pads is formed on the back side surface of the first substrate. The assembly of the first substrate and the temporary substrate is diced to form a plurality of stacks, each including an assembly of a first semiconductor chip and a handle portion. A second semiconductor chip is bonded to an assembly through an array of the second solder balls. The handle portion is removed from each assembly by reflowing the array of the first solder balls, while the array of the second solder balls does not reflow. The assembly is subsequently mounted on a packaging substrate employing the array of the first solder balls.
42 Citations
20 Claims
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1. A method of forming a multi-chip assembly of semiconductor chips comprising:
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forming a stacked substrate assembly by bonding a semiconductor substrate to a temporary substrate through an array of first solder balls that bonds to an array of first solder pads on said semiconductor substrate; dicing said stacked substrate assembly to form a plurality of stacked temporary structures, each of said plurality of stacked temporary structures comprising a first semiconductor chip that is a portion of said semiconductor substrate and a handle portion that is a portion of said temporary substrate; bonding a second semiconductor chip to a stacked temporary structure among said plurality of stacked temporary structures, wherein an array of second solder balls is bonded to an array of second solder pads located on a first semiconductor chip in said stacked temporary structure and an array of third solder pads located on said second semiconductor chip; detaching a handle portion from said stacked temporary structure to form a stacked semiconductor chip structure; and forming a multi-chip assembly of semiconductor chips by bonding at least one stacked semiconductor chip structure including said stacked semiconductor chip structure to a packaging substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification