Light emitting diode package and method of manufacturing the same
First Claim
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1. A light emitting diode package comprising:
- a package body including a plurality of electric connections, wherein a lower portion of the package body includes a first region, a second region, and a third region, wherein the second region includes a concave portion and is disposed between the first region and the third region;
a plurality of light emitting diode (LED) chips on the package body, wherein the plurality of LED chips are disposed on the same horizontal plane, wherein the plurality of LED chips include a first and a second electrode and include at least one vertical type LED chip including the first and the second electrode disposed on an upper surface and a lower surface of the at least one vertical type LED chip, respectively, the vertical type LED chip including an n-electrode disposed on the upper surface of the vertical type LED chip, and wherein the plurality of LED chips are configured to emit light having a same color; and
a phosphor layer covering a top surface of the plurality of LED chips, said phosphor layer having one of a flat shape surface, a concave shape, or a convex shape and configured to make the light emitted by the plurality of LED chips with the same color into a white color,wherein at least two electrodes respectively disposed on upper surfaces of at least two LED chips are commonly connected to at least one of the plurality of electric connections using wires,wherein an end of an electric connection corresponding to the vertical type LED chip penetrates the package body,wherein the plurality of LED chips are disposed in the package body, andwherein the at least one vertical type LED chip is directly bonded to the electric connection corresponding to the at least one vertical type LED chip using a conductive adhesive.
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Abstract
Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.
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Citations
26 Claims
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1. A light emitting diode package comprising:
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a package body including a plurality of electric connections, wherein a lower portion of the package body includes a first region, a second region, and a third region, wherein the second region includes a concave portion and is disposed between the first region and the third region; a plurality of light emitting diode (LED) chips on the package body, wherein the plurality of LED chips are disposed on the same horizontal plane, wherein the plurality of LED chips include a first and a second electrode and include at least one vertical type LED chip including the first and the second electrode disposed on an upper surface and a lower surface of the at least one vertical type LED chip, respectively, the vertical type LED chip including an n-electrode disposed on the upper surface of the vertical type LED chip, and wherein the plurality of LED chips are configured to emit light having a same color; and a phosphor layer covering a top surface of the plurality of LED chips, said phosphor layer having one of a flat shape surface, a concave shape, or a convex shape and configured to make the light emitted by the plurality of LED chips with the same color into a white color, wherein at least two electrodes respectively disposed on upper surfaces of at least two LED chips are commonly connected to at least one of the plurality of electric connections using wires, wherein an end of an electric connection corresponding to the vertical type LED chip penetrates the package body, wherein the plurality of LED chips are disposed in the package body, and wherein the at least one vertical type LED chip is directly bonded to the electric connection corresponding to the at least one vertical type LED chip using a conductive adhesive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 17, 18)
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12. A light emitting diode package comprising:
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a package body including a plurality of electrical connections and a nonconductive substrate, wherein a lower surface of the package body includes a first region, a second region, and a third region, wherein the second region includes a concave portion and is disposed between the first region and the third region, wherein at least two electrical connections are disposed in the first region and/or the second region of the package body, and wherein the at least two electrical connections pass through the package body in a direction from a top surface of the package body to the lower surface of the package body; a plurality of light emitting diode (LED) chips arranged in a line on the package body, wherein the plurality of LED chips are disposed on the same horizontal plane, and wherein the plurality of LED chips are configured to emit blue light and include at least one horizontal type LED chip with two electrodes disposed on a same side of the at least one horizontal type LED chip; a plurality of wires connected to the plurality of LED chips; and a phosphor layer including a phosphor covering the plurality of LED chips, wherein the phosphor layer has one of a substantially flat shape surface, a concave shape, or a convex shape and is configured to make the blue light emitted by the plurality of LED chips into a white color. - View Dependent Claims (13, 14, 15, 16)
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19. A light emitting diode package comprising:
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a package body including a plurality of electric connections, wherein a lower portion of the package body includes a first region, a second region, and a third region, wherein the second region includes a concave portion and is disposed between the first region and the third region; a plurality of light emitting diode (LED) chips on the package body, wherein the plurality of LED chips are disposed on the same horizontal plane, wherein the plurality of LED chips include a first and a second electrode and include at least one horizontal type LED chip including the first and the second electrode disposed on upper surfaces of the at least one horizontal type LED chip, respectively, wherein the plurality of LED chips are configured to emit light having a same color, and wherein at least one of the plurality of LED chips is disposed on at least one electric connection of the plurality of electric connections in the second region; and a phosphor layer covering a top surface of the plurality of LED chips, said phosphor layer having one of a flat shape surface, a concave shape, or a convex shape and configured to make the light emitted by the plurality of LED chips with the same color into a white color, wherein at least two electrodes respectively disposed on upper surfaces of at least two LED chips are commonly connected to at least one of the plurality of electric connections using wires, and wherein at least one electric connection in the second region is exposed out of the package body. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26)
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Specification